Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 其他特性 | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e4 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUFFER |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟(tpd) | 175.5 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9582901VEC | 5962R9582901VXC | CD4010BFMSR | CD4010BDMSR | CD4010BHMSR | CD4010BKMSR | |
|---|---|---|---|---|---|---|
| 描述 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDFP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16 | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS | Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDFP16 |
| 包装说明 | , | , | DIP, DIP16,.3 | DIP, DIP16,.3 | DIE, | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR | DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T16 | R-CDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | X-XUUC-N14 | R-CDFP-F16 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 功能数量 | 6 | 6 | 6 | 6 | 6 | 6 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 14 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | IN-LINE | UNCASED CHIP | FLATPACK |
| 传播延迟(tpd) | 175.5 ns | 175.5 ns | 175.5 ns | 175.5 ns | 175.5 ns | 175.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL |
| JESD-609代码 | e4 | e4 | e0 | e0 | - | e0 |
| 端子面层 | GOLD | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | 100k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| 封装代码 | - | - | DIP | DIP | DIE | DFP |
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