CD4010BHMSR概述

Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS

CD4010BHMSR规格参数

参数名称	属性值
厂商名称	Harris
包装说明	DIE,
Reach Compliance Code	unknown
其他特性	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR
系列	4000/14000/40000
JESD-30 代码	X-XUUC-N14
负载电容（CL）	50 pF
逻辑集成电路类型	BUFFER
功能数量	6
输入次数	1
端子数量	14
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	UNSPECIFIED
封装代码	DIE
封装形状	UNSPECIFIED
封装形式	UNCASED CHIP
传播延迟（tpd）	175.5 ns
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	NO LEAD
端子位置	UPPER

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CD4010BHMSR相似产品对比

	CD4010BHMSR	5962R9582901VEC	5962R9582901VXC	CD4010BFMSR	CD4010BDMSR	CD4010BKMSR
描述	Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS	Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16	Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDFP16	Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16	Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDIP16	Buffer, 4000/14000/40000 Series, 6-Func, 1-Input, CMOS, CDFP16
包装说明	DIE,	,	,	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR
系列	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 代码	X-XUUC-N14	R-GDIP-T16	R-CDFP-F16	R-GDIP-T16	R-GDIP-T16	R-CDFP-F16
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
功能数量	6	6	6	6	6	6
输入次数	1	1	1	1	1	1
端子数量	14	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
封装主体材料	UNSPECIFIED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
封装形状	UNSPECIFIED	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	UNCASED CHIP	IN-LINE	FLATPACK	IN-LINE	IN-LINE	FLATPACK
传播延迟（tpd）	175.5 ns	175.5 ns	175.5 ns	175.5 ns	175.5 ns	175.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	NO	YES	NO	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT
端子位置	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL
封装代码	DIE	-	-	DIP	DIP	DFP
JESD-609代码	-	e4	e4	e0	e0	e0
端子面层	-	GOLD	GOLD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
总剂量	-	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V
Base Number Matches	-	1	1	1	1	-

CD4010BHMSR

CD4010BHMSR概述

CD4010BHMSR规格参数

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CD4010BHMSR相似产品对比

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