QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14
四 1通道, 单刀单掷开关, PDIP14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | _compli |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.495 mm |
| 正常位置 | NO |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 标称断态隔离度 | 50 dB |
| 通态电阻匹配规范 | 40 Ω |
| 最大通态电阻 (Ron) | 255 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 12 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | NO |
| 最长断开时间 | 37 ns |
| 最长接通时间 | 45 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| MC54HC4066J | MC74HC4066 | MC74HC4066N | MC74HC4066DT | MC74HC4066D | MC54HC4066 | |
|---|---|---|---|---|---|---|
| 描述 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 |
| 功能数量 | 1 | 4 | 1 | 1 | 1 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 符合 | 不符合 | - |
| 厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - |
| 零件包装代码 | DIP | - | DIP | TSSOP | SOIC | - |
| 包装说明 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | SOP, SOP14,.25 | - |
| 针数 | 14 | - | 14 | 14 | 14 | - |
| Reach Compliance Code | _compli | - | not_compliant | unknow | _compli | - |
| 模拟集成电路 - 其他类型 | SPST | - | SPST | SPST | SPST | - |
| JESD-30 代码 | R-GDIP-T14 | - | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | - |
| JESD-609代码 | e0 | - | e0 | e4 | e0 | - |
| 长度 | 19.495 mm | - | 18.86 mm | 5 mm | 8.65 mm | - |
| 正常位置 | NO | - | NO | NO | NO | - |
| 信道数量 | 4 | - | 4 | 4 | 4 | - |
| 标称断态隔离度 | 50 dB | - | 50 dB | 50 dB | 50 dB | - |
| 通态电阻匹配规范 | 40 Ω | - | 40 Ω | 40 Ω | 40 Ω | - |
| 最大通态电阻 (Ron) | 255 Ω | - | 255 Ω | 255 Ω | 255 Ω | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
| 输出 | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | - | DIP | TSSOP | SOP | - |
| 封装等效代码 | DIP14,.3 | - | DIP14,.3 | TSSOP14,.25 | SOP14,.25 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | - | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - |
| 电源 | 2/12 V | - | 2/12 V | 2/12 V | 2/12 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.08 mm | - | 4.69 mm | 1.2 mm | 1.75 mm | - |
| 最大供电电压 (Vsup) | 12 V | - | 12 V | 12 V | 12 V | - |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V | 2 V | - |
| 标称供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - |
| 表面贴装 | NO | - | NO | YES | YES | - |
| 最长断开时间 | 37 ns | - | 37 ns | 37 ns | 37 ns | - |
| 最长接通时间 | 45 ns | - | 45 ns | 45 ns | 45 ns | - |
| 切换 | BREAK-BEFORE-MAKE | - | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 2.54 mm | - | 2.54 mm | 0.65 mm | 1.27 mm | - |
| 宽度 | 7.62 mm | - | 7.62 mm | 4.4 mm | 3.9 mm | - |
| 器件名 | 厂商 | 描述 |
|---|---|---|
| 5962-8950701CA | Texas Instruments(德州仪器) | High Speed CMOS Logic Quad Bilateral Switch 14-CDIP -55 to 125 |
| CD54HC4066F3A | Texas Instruments(德州仪器) | High Speed CMOS Logic Quad Bilateral Switch 14-CDIP -55 to 125 |
| TLC4066IN | Texas Instruments(德州仪器) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 |
| MC54HC4066J | Motorola ( NXP ) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 |
| CD74HC4066E | Renesas(瑞萨电子) | SGL POLE SGL THROW SWITCH |
| 933669110652 | NXP(恩智浦) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14, 0.300 INCH, PLASTIC, DIP-14 |
| MM54HC4066J | National Semiconductor（TI ） | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, CERAMIC, DIP-14, Multiplexer or Switch |
| TC74HC4066AP | Toshiba(东芝) | Analog Switch ICs Quad Switch |
| MC74HC4066N | ON Semiconductor(安森美) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 |
| HD74HC4066P | Renesas(瑞萨电子) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 |
| TLC4066MJ | Texas Instruments(德州仪器) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14 |
| 74HC4066NB | NXP(恩智浦) | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14, Multiplexer or Switch |
| MC74HC4066N | Motorola ( NXP ) | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14, PLASTIC, DIP-14 |
| SN74HC4066PW | Texas Instruments(德州仪器) | Quadruple Bilateral Analog Switches 14-TSSOP -40 to 85 |
| CD4051BPWRG4 | Texas Instruments(德州仪器) | Analog Multiplexer Single 8:1 16-Pin TSSOP T/R |
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