| 型号 |
MAX3100CEE |
MAX3100CEE+ |
MAX3100CEE-T |
MAX3100EEE |
MAX3100EEE+ |
MAX3100EEE-T |
MAX3100EPD |
MAX3100EPD- |
MAX3100ETG+ |
MAX3100ETG+T |
| 描述 |
UART Interface IC SPI/uWire Compatible |
UART Interface IC SPI/uWire Compatible |
UART Interface IC SPI/uWire Compatible |
UART Interface IC SPI/MICROWIRE-Compatible UART |
UART Interface IC SPI/uWire Compatible |
UART Interface IC SPI/MICROWIRE-Compatible UART |
UART Interface IC SPI/MICROWIRE-Compatible UART |
UART Interface IC SPI/uWire Compatible |
UART Interface IC SPI/uWire Compatible |
UART Interface IC SPI/uWire Compatible |
| 是否无铅 |
含铅 |
不含铅 |
含铅 |
含铅 |
不含铅 |
含铅 |
含铅 |
- |
不含铅 |
- |
| 是否Rohs认证 |
不符合 |
符合 |
不符合 |
不符合 |
符合 |
不符合 |
不符合 |
- |
符合 |
符合 |
| 零件包装代码 |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
DIP |
- |
QFN |
- |
| 包装说明 |
0.150 INCH, 0.025 INCH PITCH, QSOP-16 |
SSOP, SSOP16,.25 |
0.150 INCH, 0.025 INCH PITCH, QSOP-16 |
0.150 INCH, 0.025 INCH PITCH, QSOP-16 |
SSOP, SSOP16,.25 |
0.150 INCH, 0.025 INCH PITCH, QSOP-16 |
PLASTIC, DIP-14 |
- |
HVQCCN, LCC24,.16SQ,20 |
HVQCCN, |
| 针数 |
16 |
16 |
16 |
16 |
16 |
16 |
14 |
- |
24 |
- |
| Reach Compliance Code |
not_compliant |
compliant |
not_compliant |
not_compliant |
compliant |
not_compliant |
not_compliant |
- |
compliant |
compliant |
| ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
EAR99 |
| 边界扫描 |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
- |
NO |
NO |
| 最大时钟频率 |
3.6864 MHz |
3.6864 MHz |
3.6864 MHz |
3.6864 MHz |
3.6864 MHz |
3.6864 MHz |
3.6864 MHz |
- |
3.6864 MHz |
- |
| 通信协议 |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
- |
ASYNC, BIT |
ASYNC, BIT |
| 最大数据传输速率 |
0.028125 MBps |
0.028125 MBps |
0.028125 MBps |
0.028125 MBps |
0.028125 MBps |
0.028125 MBps |
0.028125 MBps |
- |
0.028125 MBps |
0.028125 MBps |
| JESD-30 代码 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDIP-T14 |
- |
S-XQCC-N24 |
S-XQCC-N24 |
| JESD-609代码 |
e0 |
e3 |
e0 |
e0 |
e3 |
e0 |
e0 |
- |
- |
- |
| 长度 |
4.89 mm |
4.89 mm |
4.89 mm |
4.89 mm |
4.89 mm |
4.89 mm |
19.05 mm |
- |
4 mm |
4 mm |
| 低功率模式 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
- |
YES |
YES |
| 湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
- |
1 |
| 串行 I/O 数 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
| 端子数量 |
16 |
16 |
16 |
16 |
16 |
16 |
14 |
- |
24 |
24 |
| 最高工作温度 |
70 °C |
70 °C |
70 °C |
85 °C |
85 °C |
85 °C |
85 °C |
- |
85 °C |
85 °C |
| 最低工作温度 |
- |
- |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
UNSPECIFIED |
UNSPECIFIED |
| 封装代码 |
SSOP |
SSOP |
SSOP |
SSOP |
SSOP |
SSOP |
DIP |
- |
HVQCCN |
HVQCCN |
| 封装等效代码 |
SSOP16,.25 |
SSOP16,.25 |
SSOP16,.25 |
SSOP16,.25 |
SSOP16,.25 |
SSOP16,.25 |
DIP14,.3 |
- |
LCC24,.16SQ,20 |
- |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
SQUARE |
SQUARE |
| 封装形式 |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
IN-LINE |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) |
240 |
260 |
240 |
240 |
260 |
240 |
240 |
- |
NOT SPECIFIED |
- |
| 电源 |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
- |
3/5 V |
- |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
- |
| 座面最大高度 |
1.73 mm |
1.73 mm |
1.73 mm |
1.73 mm |
1.73 mm |
1.73 mm |
4.572 mm |
- |
0.8 mm |
0.8 mm |
| 最大供电电压 |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
5.5 V |
| 最小供电电压 |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
- |
2.7 V |
2.7 V |
| 标称供电电压 |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
3.3 V |
| 表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
NO |
- |
YES |
YES |
| 技术 |
CMOS |
BICMOS |
CMOS |
CMOS |
BICMOS |
CMOS |
CMOS |
- |
BICMOS |
BICMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
| 端子面层 |
Tin/Lead (Sn85Pb15) |
Matte Tin (Sn) |
Tin/Lead (Sn85Pb15) |
TIN LEAD |
Matte Tin (Sn) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
- |
- |
- |
| 端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
- |
NO LEAD |
NO LEAD |
| 端子节距 |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
2.54 mm |
- |
0.5 mm |
0.5 mm |
| 端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |
QUAD |
QUAD |
| 处于峰值回流温度下的最长时间 |
20 |
30 |
20 |
20 |
30 |
20 |
20 |
- |
NOT SPECIFIED |
- |
| 宽度 |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
7.62 mm |
- |
4 mm |
4 mm |
| uPs/uCs/外围集成电路类型 |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
- |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |