| 型号 |
74HC4052BQ,115 |
74HC4052D |
74HC4052D,652 |
74HC4052D,653 |
74HC4052DB,112 |
74HC4052DB,118 |
74HC4052N,652 |
74HC4052PW |
| 描述 |
Multiplexer Switch ICs DUAL 4-CH ANALOG |
Multiplexer Switch ICs DL 4CH ANLG MUX/DMUX |
Multiplexer Switch ICs DL 4CH ANLG MUX/DMUX |
Multiplexer Switch ICs DUAL 4-CHANNEL ANALOG MUX/DMUX |
Multiplexer Switch ICs DUAL 4-CH ANALOG |
Multiplexer Switch ICs DUAL 4-CH ANALOG |
多路复用开关 IC DL 4CH ANLG MUX/DMUX |
Multiplexer Switch ICs DUAL 4CH MUX/DMUX |
| 厂商名称 |
NXP(恩智浦) |
NXP(恩智浦) |
NXP(恩智浦) |
NXP(恩智浦) |
NXP(恩智浦) |
NXP(恩智浦) |
Nexperia |
NXP(恩智浦) |
| 长度 |
3.5 mm |
9.9 mm |
9.9 mm |
9.9 mm |
6.2 mm |
6.2 mm |
19.5 mm |
5 mm |
| 宽度 |
2.5 mm |
3.9 mm |
3.9 mm |
3.9 mm |
5.3 mm |
5.3 mm |
6.48 mm |
4.4 mm |
| Brand Name |
NXP Semiconductor |
- |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
- |
- |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
- |
符合 |
| 零件包装代码 |
QFN |
SOIC |
SOP |
SOP |
SSOP1 |
SSOP1 |
- |
TSSOP |
| 包装说明 |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 |
SOP, SOP16,.25 |
SOP, SOP16,.25 |
3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16 |
SSOP, SSOP16,.3 |
SSOP, SSOP16,.3 |
- |
TSSOP, TSSOP16,.25 |
| 针数 |
16 |
16 |
16 |
16 |
16 |
16 |
- |
16 |
| 制造商包装代码 |
SOT763-1 |
- |
SOT109-1 |
SOT109-1 |
SOT338-1 |
SOT338-1 |
- |
- |
| Reach Compliance Code |
compliant |
unknown |
compliant |
compliant |
compliant |
compliant |
- |
compliant |
| 模拟集成电路 - 其他类型 |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
- |
DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 |
R-PQCC-N16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
- |
R-PDSO-G16 |
| JESD-609代码 |
e4 |
- |
e4 |
- |
e4 |
e4 |
- |
e4 |
| 湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |
| 负电源电压最大值(Vsup) |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
- |
-5 V |
| 负电源电压最小值(Vsup) |
-1 V |
-1 V |
-1 V |
-1 V |
-1 V |
-1 V |
- |
-1 V |
| 标称负供电电压 (Vsup) |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
- |
-4.5 V |
| 信道数量 |
4 |
4 |
4 |
4 |
4 |
4 |
- |
4 |
| 功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |
| 端子数量 |
16 |
16 |
16 |
16 |
16 |
16 |
- |
16 |
| 标称断态隔离度 |
50 dB |
50 dB |
50 dB |
50 dB |
50 dB |
50 dB |
- |
50 dB |
| 通态电阻匹配规范 |
6 Ω |
6 Ω |
6 Ω |
6 Ω |
6 Ω |
6 Ω |
- |
6 Ω |
| 最大通态电阻 (Ron) |
195 Ω |
195 Ω |
195 Ω |
195 Ω |
195 Ω |
195 Ω |
- |
195 Ω |
| 最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
- |
125 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| 封装代码 |
HVQCCN |
SOP |
SOP |
SOP |
SSOP |
SSOP |
- |
TSSOP |
| 封装等效代码 |
LCC16,.1X.14,20 |
SOP16,.25 |
SOP16,.25 |
SOP16,.25 |
SSOP16,.3 |
SSOP16,.3 |
- |
TSSOP16,.25 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
| 封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
- |
260 |
| 电源 |
2/6 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
2/6 V |
- |
2/6,GND/-6 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
| 座面最大高度 |
1 mm |
1.75 mm |
1.75 mm |
1.75 mm |
2 mm |
2 mm |
- |
1.1 mm |
| 最大信号电流 |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
- |
0.025 A |
| 最大供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
- |
5 V |
| 最小供电电压 (Vsup) |
1 V |
1 V |
1 V |
1 V |
1 V |
1 V |
- |
1 V |
| 标称供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
- |
4.5 V |
| 表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
- |
YES |
| 最长断开时间 |
57 ns |
57 ns |
57 ns |
57 ns |
57 ns |
57 ns |
- |
57 ns |
| 最长接通时间 |
69 ns |
69 ns |
69 ns |
69 ns |
69 ns |
69 ns |
- |
69 ns |
| 切换 |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
CMOS |
| 温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
- |
AUTOMOTIVE |
| 端子面层 |
NICKEL PALLADIUM GOLD |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
NICKEL PALLADIUM GOLD |
| 端子形式 |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
- |
GULL WING |
| 端子节距 |
0.5 mm |
1.27 mm |
1.27 mm |
1.27 mm |
0.65 mm |
0.65 mm |
- |
0.65 mm |
| 端子位置 |
QUAD |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |
DUAL |
| 处于峰值回流温度下的最长时间 |
30 |
30 |
30 |
30 |
30 |
30 |
- |
30 |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |