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74HC4052PW: 产品描述Multiplexer Switch ICs DUAL 4CH MUX/DMUX; 产品类别模拟混合信号IC 信号电路; 文件大小315KB，共28页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HC4052PW概述

Multiplexer Switch ICs DUAL 4CH MUX/DMUX

74HC4052PW规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP
包装说明	TSSOP, TSSOP16,.25
针数	16
Reach Compliance Code	compliant
模拟集成电路 - 其他类型	DIFFERENTIAL MULTIPLEXER
JESD-30 代码	R-PDSO-G16
JESD-609代码	e4
长度	5 mm
湿度敏感等级	1
负电源电压最大值（Vsup）	-5 V
负电源电压最小值（Vsup）	-1 V
标称负供电电压 (Vsup)	-4.5 V
信道数量	4
功能数量	1
端子数量	16
标称断态隔离度	50 dB
通态电阻匹配规范	6 Ω
最大通态电阻 (Ron)	195 Ω
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP16,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	2/6,GND/-6 V
认证状态	Not Qualified
座面最大高度	1.1 mm
最大信号电流	0.025 A
最大供电电流 (Isup)	0.32 mA
最大供电电压 (Vsup)	5 V
最小供电电压 (Vsup)	1 V
标称供电电压 (Vsup)	4.5 V
表面贴装	YES
最长断开时间	57 ns
最长接通时间	69 ns
切换	BREAK-BEFORE-MAKE
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	4.4 mm
Base Number Matches	1

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74HC4052; 74HCT4052

Rev. 12 — 10 October 2017

Dual 4-channel analog multiplexer/demultiplexer

Product data sheet

General description

The 74HC4052; 74HCT4052 is a dual single-pole quad-throw analog switch (2x SP4T)

suitable for use in analog or digital 4:1 multiplexer/demultiplexer applications. Each

switch features four independent inputs/outputs (nY0, nY1, nY2 and nY3) and a common

input/output (nZ). A digital enable input (E) and two digital select inputs (S0 and S1) are

common to both switches. When E is HIGH, the switches are turned off. Inputs include

clamp diodes. This enables the use of current limiting resistors to interface inputs to

voltages in excess of V

Features and benefits

•

Wide analog input voltage range from -5 V to +5 V

•

Low ON resistance:

–

80 Ω (typical) at V

- V

= 4.5 V

–

70 Ω (typical) at V

- V

= 6.0 V

–

60 Ω (typical) at V

- V

= 9.0 V

•

Logic level translation: to enable 5 V logic to communicate with ±5 V analog signals

•

Typical ‘break before make’ built-in

•

Complies with JEDEC standard no. 7A

•

Input levels:

–

For 74HC4052: CMOS level

–

For 74HCT4052: TTL level

•

ESD protection:

–

HBM JESD22-A114F exceeds 2000 V

–

MM JESD22-A115-A exceeds 200 V

–

CDM JESD22-C101E exceeds 1000 V

•

Specified from -40 °C to +85 °C and -40 °C to +125 °C

Applications

•

Analog multiplexing and demultiplexing

•

Digital multiplexing and demultiplexing

•

Signal gating

74HC4052PW相似产品对比

	74HC4052PW	74HC4052DB,118	74HC4052D,652	74HC4052D	74HC4052D,653	74HC4052DB,112	74HC4052BQ,115	74HCT4052N	74HCT4052PW,118
描述	Multiplexer Switch ICs DUAL 4CH MUX/DMUX	Multiplexer Switch ICs DUAL 4-CH ANALOG	Multiplexer Switch ICs DL 4CH ANLG MUX/DMUX	Multiplexer Switch ICs DL 4CH ANLG MUX/DMUX	Multiplexer Switch ICs DUAL 4-CHANNEL ANALOG MUX/DMUX	Multiplexer Switch ICs DUAL 4-CH ANALOG	Multiplexer Switch ICs DUAL 4-CH ANALOG	Multiplexer Switch ICs DUAL 4-CH ANALOG MUX/DMUX	Multiplexer Switch ICs 16IN 4.5-5.5V 500 mW
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	TSSOP	SSOP1	SOP	SOIC	SOP	SSOP1	QFN	DIP	TSSOP
包装说明	TSSOP, TSSOP16,.25	SSOP, SSOP16,.3	SOP, SOP16,.25	SOP, SOP16,.25	3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16	SSOP, SSOP16,.3	2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16	DIP, DIP16,.3	4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
针数	16	16	16	16	16	16	16	16	16
Reach Compliance Code	compliant	compliant	compliant	unknown	compliant	compliant	compliant	unknown	compliant
Base Number Matches	1	1	1	1	1	1	1	1	1
模拟集成电路 - 其他类型	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	-
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PQCC-N16	R-PDIP-T16	-
JESD-609代码	e4	e4	e4	-	-	e4	e4	e4	-
长度	5 mm	6.2 mm	9.9 mm	9.9 mm	9.9 mm	6.2 mm	3.5 mm	19.05 mm	-
湿度敏感等级	1	1	1	1	1	1	1	-	-
负电源电压最大值（Vsup）	-5 V	-5 V	-5 V	-5 V	-5 V	-5 V	-5 V	-5 V	-
负电源电压最小值（Vsup）	-1 V	-1 V	-1 V	-1 V	-1 V	-1 V	-1 V	-1 V	-
标称负供电电压 (Vsup)	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-
信道数量	4	4	4	4	4	4	4	4	-
功能数量	1	1	1	1	1	1	1	1	-
端子数量	16	16	16	16	16	16	16	16	-
标称断态隔离度	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB	-
通态电阻匹配规范	6 Ω	6 Ω	6 Ω	6 Ω	6 Ω	6 Ω	6 Ω	6 Ω	-
最大通态电阻 (Ron)	195 Ω	195 Ω	195 Ω	195 Ω	195 Ω	195 Ω	195 Ω	195 Ω	-
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	-
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	TSSOP	SSOP	SOP	SOP	SOP	SSOP	HVQCCN	DIP	-
封装等效代码	TSSOP16,.25	SSOP16,.3	SOP16,.25	SOP16,.25	SOP16,.25	SSOP16,.3	LCC16,.1X.14,20	DIP16,.3	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	-
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	NOT SPECIFIED	-
电源	2/6,GND/-6 V	2/6 V	2/6,GND/-6 V	2/6,GND/-6 V	2/6,GND/-6 V	2/6,GND/-6 V	2/6 V	5,GND/-5 V	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
座面最大高度	1.1 mm	2 mm	1.75 mm	1.75 mm	1.75 mm	2 mm	1 mm	4.32 mm	-
最大信号电流	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	-
最大供电电流 (Isup)	0.32 mA	0.32 mA	-	-	-	0.32 mA	0.32 mA	0.16 mA	-
最大供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
最小供电电压 (Vsup)	1 V	1 V	1 V	1 V	1 V	1 V	1 V	1 V	-
标称供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
表面贴装	YES	YES	YES	YES	YES	YES	YES	NO	-
最长断开时间	57 ns	57 ns	57 ns	57 ns	57 ns	57 ns	57 ns	57 ns	-
最长接通时间	69 ns	69 ns	69 ns	69 ns	69 ns	69 ns	69 ns	72 ns	-
切换	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	-
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
端子面层	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL/PALLADIUM/GOLD (NI/PD/AU)	NICKEL/PALLADIUM/GOLD (NI/PD/AU)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	-
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	THROUGH-HOLE	-
端子节距	0.65 mm	0.65 mm	1.27 mm	1.27 mm	1.27 mm	0.65 mm	0.5 mm	2.54 mm	-
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	-
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	NOT SPECIFIED	-
宽度	4.4 mm	5.3 mm	3.9 mm	3.9 mm	3.9 mm	5.3 mm	2.5 mm	7.62 mm	-
Brand Name	-	NXP Semiconductor	NXP Semiconductor	-	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-	NXP Semiconductor
制造商包装代码	-	SOT338-1	SOT109-1	-	SOT109-1	SOT338-1	SOT763-1	-	SOT403-1

74HC4052PW

74HC4052PW在线购买

74HC4052PW概述

74HC4052PW规格参数

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74HC4052PW相似产品对比

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