| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| 70T3399S133BC | IDT(艾迪悌) | SRAM 128K X 18 DP | 下载 |
| 70T3399S133BC | IDT (Integrated Device Technology) | CABGA-256, Tray | 下载 |
| 70T3399S133BC8 | IDT(艾迪悌) | SRAM 128K X 18 DP | 下载 |
| 70T3399S133BC8 | IDT (Integrated Device Technology) | CABGA-256, Reel | 下载 |
| 70T3399S133BCG | IDT(艾迪悌) | HIGH-SPEED SYNCHRONOUS DUAL-PORT STATIC RAM | 下载 |
| 70T3399S133BCG | IDT (Integrated Device Technology) | Dual-Port SRAM, 128KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | 下载 |
| 70T3399S133BCG8 | IDT(艾迪悌) | HIGH-SPEED SYNCHRONOUS DUAL-PORT STATIC RAM | 下载 |
| 70T3399S133BCG8 | IDT (Integrated Device Technology) | Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | 下载 |
| 70T3399S133BCGI | IDT(艾迪悌) | HIGH-SPEED SYNCHRONOUS DUAL-PORT STATIC RAM | 下载 |
| 70T3399S133BCGI | IDT (Integrated Device Technology) | Dual-Port SRAM, 128KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 | 下载 |
| 70T3399S133BCGI8 | IDT(艾迪悌) | HIGH-SPEED SYNCHRONOUS DUAL-PORT STATIC RAM | 下载 |
| 70T3399S133BCGI8 | IDT (Integrated Device Technology) | Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | 下载 |
| 70T3399S133BCI | IDT(艾迪悌) | SRAM 128K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's | 下载 |
| 70T3399S133BCI | IDT (Integrated Device Technology) | CABGA-256, Tray | 下载 |
| 70T3399S133BCI8 | IDT (Integrated Device Technology) | SRAM 128K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| 70T3399S133BC 、 70T3399S133BC8 、 70T3399S133BCI | 下载文档 |
| 70T3399S133BCG 、 70T3399S133BCGI | 下载文档 |
| 70T3399S133BC 、 70T3399S133BCI8 | 下载文档 |
| 70T3399S133BCG8 、 70T3399S133BCGI8 | 下载文档 |
| 70T3399S133BCI | 下载文档 |
| 70T3399S133BC8 | 下载文档 |
| 型号 | 70T3399S133BC | 70T3399S133BC8 | 70T3399S133BCI |
|---|---|---|---|
| 描述 | CABGA-256, Tray | CABGA-256, Reel | CABGA-256, Tray |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | CABGA | CABGA | CABGA |
| 包装说明 | LBGA, BGA256,16X16,40 | LBGA, BGA256,16X16,40 | LBGA, BGA256,16X16,40 |
| 针数 | 256 | 256 | 256 |
| 制造商包装代码 | BC256 | BC256 | BC256 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991 |
| 最长访问时间 | 15 ns | 15 ns | 15 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 133 MHz | 133 MHz | 133 MHz |
| I/O 类型 | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 17 mm | 17 mm | 17 mm |
| 内存密度 | 2359296 bit | 2359296 bit | 2359296 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 18 | 18 | 18 |
| 湿度敏感等级 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 256 | 256 | 256 |
| 字数 | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C |
| 组织 | 128KX18 | 128KX18 | 128KX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA |
| 封装等效代码 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 225 | 225 | 225 |
| 电源 | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.5 mm | 1.5 mm | 1.5 mm |
| 最大待机电流 | 0.015 A | 0.015 A | 0.02 A |
| 最小待机电流 | 2.4 V | 2.4 V | 2.4 V |
| 最大压摆率 | 0.37 mA | 0.37 mA | 0.45 mA |
| 最大供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V |
| 最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 17 mm | 17 mm | 17 mm |
| Base Number Matches | 1 | 1 | 1 |
| Samacsys Description | CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM | CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM | - |
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