Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK11DX128AVLK5

MK11DX128AVLK5: 产品描述ARM Microcontrollers - MCU BL Microcontrollers; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共60页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK11DX128AVLK5概述

ARM Microcontrollers - MCU BL Microcontrollers

MK11DX128AVLK5规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
厂商名称	NXP(恩智浦)
包装说明	LQFP-80
Reach Compliance Code	unknown
Is Samacsys	N
Base Number Matches	1

文档解析

这份文档是关于Kinetis K11D系列微控制器的数据手册，包含了大量的技术信息，以下是一些值得关注的要点：

微控制器家族: Kinetis K11D系列是针对成本敏感、需要低功耗和高处理效率的应用而优化的产品家族。
核心性能: 基于ARM® Cortex®-M4核心，具有DSP指令集，最高运行频率可达50 MHz。
内存容量: 提供最高512 KB的闪存和最高64 KB的SRAM。
功耗: 运行功耗低至189 μA/MHz，静态功耗低至3.1 μA，并具有快速唤醒时间6 μs。
安全特性: 包括DryIce防篡改检测、硬件CRC模块、安全存储、硬件随机数生成器和硬件加密支持。
通信接口: 包括两个SPI模块、两个I2C模块、四个UART模块和一个I2S模块。
定时器: 包括8通道电机控制/通用/PWM定时器、两个2通道通用定时器、32位PIT和16位低功耗定时器。
模拟模块: 包括16位SAR ADC和两个模拟比较器。
操作特性: 工作电压范围1.71至3.6 V，闪存写入电压范围相同，环境温度范围-40至105°C。
封装选项: 提供多种封装类型，包括80引脚QFP等。
安全性和完整性模块: 提供了硬件加密支持，包括DES、3DES、AES、MD5、SHA-1和SHA-256算法。
特殊功能: 包括硬件随机数生成器和硬件加密模块，以及独特的128位芯片识别号。
应用领域: 适合用于电子销售点(EPOS)等需要广泛防篡改保护的系统。
技术支持和资源: 提供了包括解决方案顾问、产品简介、参考手册、数据表和封装图纸等在内的相关资源。
修订历史: 文档包含了修订历史，记录了从2012年6月至2014年4月的更新和改进。

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document number: K11P80M50SF4V2

Rev 6, 04/2014

Kinetis K11D Sub-Family Data

Sheet

50 MHz ARM® Cortex®-M4-based Microcontroller

The K11 product family members are optimized for cost-sensitive

applications requiring low-power, processing efficiency and the

need for extensive tamper protection, such as Electronic Point of

Sales. This device shares the comprehensive enablement and

scalability of the Kinetis family.

This product offers:

• Up to 512 KB of flash memory with up to 64 KB of SRAM

• DryIce Tamper Detection with active/passive pin,

temperature, clock, supply voltage monitoring

• Run power consumption down to 189 μA/MHz and Static

power consumption down to 3.1 μA with full state retention

and 6 μs wakeup. Lowest Static mode down to 359 nA

MK11DX128AVLK5

MK11DX256AVLK5

MK11DN512AVLK5

80 QFP

12 x 12 x 1.6 mm Pitch 0.5 mm

Performance

• Up to 50 MHz ARM® Cortex®-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• Up to 512 KB of program flash

• Up to 64 KB RAM

• 64 KB FlexNVM and 4 KB FlexRAM on FlexMemory

devices

System peripherals

• Multiple low-power modes

• 16-channel DMA controller

• External watchdog monitor

• Software watchdog

Clocks

• 32 kHz and 3-32 MHz crystal oscillator

• Multipurpose clock generator

Security and integrity modules

• Hardware CRC module

• Tamper detect and secure storage

• Hardware random-number generator

• Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

• 128-bit unique identification (ID) number per chip

Communication interfaces

• Two SPI modules

• Two I2C modules

• Four UART modules

• I2S module

Timers

• 8-channel motor control/general purpose/PWM

timers

• Two 2-channel general purpose timers

• 32-bit PITs and 16-bit low-power timer

• Carrier modulator transmitter

• Real-time clock

• Programmable delay block

Analog modules

• 16-bit SAR ADC

• Two analog comparators (CMP)

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): –40 to 105°C

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 14

2.2.7 Designing with radiated emissions in mind..........15

2.2.8 Capacitance attributes.........................................15

2.3 Switching specifications...................................................15

2.3.1 Device clock specifications..................................15

2.3.2 General switching specifications......................... 16

2.4 Thermal specifications..................................................... 17

2.4.1 Thermal operating requirements......................... 17

2.4.2 Thermal attributes................................................17

3 Peripheral operating requirements and behaviors.................. 18

3.1 Core modules.................................................................. 18

3.1.1 JTAG electricals.................................................. 19

3.2 System modules.............................................................. 22

3.3 Clock modules................................................................. 22

3.3.1

3.3.2

3.3.3

MCG specifications..............................................22

Oscillator electrical specifications........................24

32 kHz oscillator electrical characteristics........... 26

3.6.1 ADC electrical specifications............................... 31

3.6.2 CMP and 6-bit DAC electrical specifications....... 36

3.7 Timers..............................................................................38

3.8 Communication interfaces............................................... 38

3.8.1 DSPI switching specifications (limited voltage

range).................................................................. 38

DSPI switching specifications (full voltage

range).................................................................. 40

3.8.3 I2C switching specifications.................................42

3.8.4 UART switching specifications............................ 42

3.8.5 I2S switching specifications.................................42

Dimensions............................................................................. 46

4.1 Obtaining package dimensions....................................... 46

Pinout...................................................................................... 46

5.1 K11 Signal Multiplexing and Pin Assignments.................46

5.2 K11 Pinouts..................................................................... 50

Ordering parts......................................................................... 51

6.1 Determining valid orderable parts....................................51

Part identification.....................................................................52

7.1 Description.......................................................................52

7.2 Format............................................................................. 52

7.3 Fields............................................................................... 52

7.4 Example...........................................................................53

7.5 Small package marking................................................... 53

8 Terminology and guidelines.................................................... 54

8.1 Definition: Operating requirement....................................54

8.2 Definition: Operating behavior......................................... 54

8.3 Definition: Attribute.......................................................... 55

8.4 Definition: Rating............................................................. 55

8.5 Result of exceeding a rating............................................ 56

8.6 Relationship between ratings and operating

requirements....................................................................56

8.7 Guidelines for ratings and operating requirements..........57

8.8 Definition: Typical value...................................................57

8.9 Typical value conditions.................................................. 58

9 Revision History...................................................................... 58

3.8.2

3.4 Memories and memory interfaces................................... 27

3.4.1 Flash electrical specifications.............................. 27

3.4.2 EzPort switching specifications........................... 30

3.5 Security and integrity modules........................................ 31

3.5.1 DryIce Tamper Electrical Specifications.............. 31

3.6 Analog............................................................................. 31