Freescale Semiconductor, Inc.
Data Sheet: Technical Data
Document number: K11P80M50SF4V2
Rev 6, 04/2014
Kinetis K11D Sub-Family Data
Sheet
50 MHz ARM® Cortex®-M4-based Microcontroller
The K11 product family members are optimized for cost-sensitive
applications requiring low-power, processing efficiency and the
need for extensive tamper protection, such as Electronic Point of
Sales. This device shares the comprehensive enablement and
scalability of the Kinetis family.
This product offers:
• Up to 512 KB of flash memory with up to 64 KB of SRAM
• DryIce Tamper Detection with active/passive pin,
temperature, clock, supply voltage monitoring
• Run power consumption down to 189 μA/MHz and Static
power consumption down to 3.1 μA with full state retention
and 6 μs wakeup. Lowest Static mode down to 359 nA
MK11DX128AVLK5
MK11DX256AVLK5
MK11DN512AVLK5
80 QFP
12 x 12 x 1.6 mm Pitch 0.5 mm
Performance
• Up to 50 MHz ARM® Cortex®-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• Up to 512 KB of program flash
• Up to 64 KB RAM
• 64 KB FlexNVM and 4 KB FlexRAM on FlexMemory
devices
System peripherals
• Multiple low-power modes
• 16-channel DMA controller
• External watchdog monitor
• Software watchdog
Clocks
• 32 kHz and 3-32 MHz crystal oscillator
• Multipurpose clock generator
Security and integrity modules
• Hardware CRC module
• Tamper detect and secure storage
• Hardware random-number generator
• Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
• 128-bit unique identification (ID) number per chip
Communication interfaces
• Two SPI modules
• Two I2C modules
• Four UART modules
• I2S module
Timers
• 8-channel motor control/general purpose/PWM
timers
• Two 2-channel general purpose timers
• 32-bit PITs and 16-bit low-power timer
• Carrier modulator transmitter
• Real-time clock
• Programmable delay block
Analog modules
• 16-bit SAR ADC
• Two analog comparators (CMP)
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): –40 to 105°C
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2013–2014 Freescale
Semiconductor, Inc. All rights reserved.
Ordering Information
1
Part Number
Flash (KB)
MK11DX128AVLK5
MK11DX256AVLK5
MK11DN512AVLK5
128 KB
256 KB
512 KB
Memory
SRAM (KB)
32
32
64
60
60
60
Maximum number of I\O's
1. To confirm current availability of ordererable part numbers, go to
http://www.freescale.com
and perform a part number
search.
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Package
drawing
Description
The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Package dimensions are provided in package drawings.
Resource
Solution Advisor
K10PB
1
K11P80M50SF4V2RM
1
K11P80M50SF4V2
1
• QFP 80-pin:
98ASS23174W
1
1. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term.
2
Freescale Semiconductor, Inc.
Kinetis K11D Sub-Family Data Sheet, Rev6, 04/2014.
Kinetis K11D Family
ARM
®
Cortex™-M4
Core
System
Internal
and external
watchdogs
Debug
interfaces
Interrupt
controller
DSP
DMA
Memories and Memory Interfaces
Program
flash
Clocks
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
RAM
FlexMemory
Serial
programming
interface
Low-leakage
wakeup
Memory
protection
unit (MPU)
Internal
reference
clocks
and Integrity
CRC
Random
number
generator
Hardware
encryption
Tamper
detect
Security
Analog
16-bit ADC
Timers
Timers
x3 (16ch)
Communication Interfaces
I
C
x2
UART
x4
SPI
x2
2
Human-Machine
Interface (HMI)
GPIO
I
S
x1
2
Analog
comparator
x2
6-bit DAC
x2
12-bit DAC
Carrier
modulator
transmitter
Programmable
delay block
Periodic
interrupt
timers
Low power
timer
Voltage
reference
Independent
real-time
clock
Figure 1. K11D block diagram
Kinetis K11D Sub-Family Data Sheet, Rev6, 04/2014.
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1 Voltage and current operating requirements....... 6
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors..... 14
2.2.7 Designing with radiated emissions in mind..........15
2.2.8 Capacitance attributes.........................................15
2.3 Switching specifications...................................................15
2.3.1 Device clock specifications..................................15
2.3.2 General switching specifications......................... 16
2.4 Thermal specifications..................................................... 17
2.4.1 Thermal operating requirements......................... 17
2.4.2 Thermal attributes................................................17
3 Peripheral operating requirements and behaviors.................. 18
3.1 Core modules.................................................................. 18
3.1.1 JTAG electricals.................................................. 19
3.2 System modules.............................................................. 22
3.3 Clock modules................................................................. 22
3.3.1
3.3.2
3.3.3
MCG specifications..............................................22
Oscillator electrical specifications........................24
32 kHz oscillator electrical characteristics........... 26
3.6.1 ADC electrical specifications............................... 31
3.6.2 CMP and 6-bit DAC electrical specifications....... 36
3.7 Timers..............................................................................38
3.8 Communication interfaces............................................... 38
3.8.1 DSPI switching specifications (limited voltage
range).................................................................. 38
DSPI switching specifications (full voltage
range).................................................................. 40
3.8.3 I2C switching specifications.................................42
3.8.4 UART switching specifications............................ 42
3.8.5 I2S switching specifications.................................42
Dimensions............................................................................. 46
4.1 Obtaining package dimensions....................................... 46
Pinout...................................................................................... 46
5.1 K11 Signal Multiplexing and Pin Assignments.................46
5.2 K11 Pinouts..................................................................... 50
Ordering parts......................................................................... 51
6.1 Determining valid orderable parts....................................51
Part identification.....................................................................52
7.1 Description.......................................................................52
7.2 Format............................................................................. 52
7.3 Fields............................................................................... 52
7.4 Example...........................................................................53
7.5 Small package marking................................................... 53
8 Terminology and guidelines.................................................... 54
8.1 Definition: Operating requirement....................................54
8.2 Definition: Operating behavior......................................... 54
8.3 Definition: Attribute.......................................................... 55
8.4 Definition: Rating............................................................. 55
8.5 Result of exceeding a rating............................................ 56
8.6 Relationship between ratings and operating
requirements....................................................................56
8.7 Guidelines for ratings and operating requirements..........57
8.8 Definition: Typical value...................................................57
8.9 Typical value conditions.................................................. 58
9 Revision History...................................................................... 58
3.8.2
4
5
6
7
3.4 Memories and memory interfaces................................... 27
3.4.1 Flash electrical specifications.............................. 27
3.4.2 EzPort switching specifications........................... 30
3.5 Security and integrity modules........................................ 31
3.5.1 DryIce Tamper Electrical Specifications.............. 31
3.6 Analog............................................................................. 31
4
Freescale Semiconductor, Inc.
Kinetis K11D Sub-Family Data Sheet, Rev6, 04/2014.
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K11D Sub-Family Data Sheet, Rev6, 04/2014.
5
Freescale Semiconductor, Inc.
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