Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK11DN512AVLK5

MK11DN512AVLK5: 产品描述ARM Microcontrollers - MCU Kinetis K11: 50MHz Cortex-M4 Performance MCU, 512KB Flash, 64KB SRAM, Anti-tamper, 80-LQFP; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共60页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK11DN512AVLK5概述

ARM Microcontrollers - MCU Kinetis K11: 50MHz Cortex-M4 Performance MCU, 512KB Flash, 64KB SRAM, Anti-tamper, 80-LQFP

MK11DN512AVLK5规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
厂商名称	NXP(恩智浦)
包装说明	LQFP-80
Reach Compliance Code	unknown

文档解析

Kinetis K11D系列微控制器在安全特性方面具备多种功能，适用于需要高安全性和可靠性的应用场景。以下是一些具体的应用场景：

电子支付系统：Kinetis K11D系列的硬件加密支持（如DES, 3DES, AES, MD5, SHA-1, SHA-256算法）可以用于安全地处理支付数据，保护交易信息不被未授权访问或篡改。
智能卡和安全身份验证：利用其硬件随机数生成器和加密功能，Kinetis K11D系列可以用于生成和验证加密密钥，为智能卡和安全身份验证系统提供支持。
医疗设备：在医疗设备中，数据的准确性和安全性至关重要。Kinetis K11D系列的高可靠性和安全性特性，如DryIce防篡改检测，可以用于监测和保护医疗设备的数据完整性。
工业控制系统：在工业控制系统中，防止未授权访问和操作是至关重要的。Kinetis K11D系列的硬件加密和安全存储功能可以用于保护控制逻辑和操作数据。
汽车电子：汽车电子系统，如引擎控制单元（ECU），需要严格的安全措施来防止黑客攻击。Kinetis K11D系列的安全性特性可以用于实现这些安全措施。
安全通信：Kinetis K11D系列提供多种通信接口（如SPI, I2C, UART等），结合其加密功能，可以用于实现安全的设备间通信。
数据存储保护：其硬件CRC模块和安全存储功能可以用于检测和防止数据在存储和传输过程中的错误和篡改。
防篡改检测系统：Kinetis K11D系列的DryIce防篡改检测功能可以用于各种需要防篡改保护的系统，如安全锁具、监控设备等。

这些安全特性使得Kinetis K11D系列微控制器非常适合用于需要高安全性和可靠性的嵌入式系统设计。

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document number: K11P80M50SF4V2

Rev 6, 04/2014

Kinetis K11D Sub-Family Data

Sheet

50 MHz ARM® Cortex®-M4-based Microcontroller

The K11 product family members are optimized for cost-sensitive

applications requiring low-power, processing efficiency and the

need for extensive tamper protection, such as Electronic Point of

Sales. This device shares the comprehensive enablement and

scalability of the Kinetis family.

This product offers:

• Up to 512 KB of flash memory with up to 64 KB of SRAM

• DryIce Tamper Detection with active/passive pin,

temperature, clock, supply voltage monitoring

• Run power consumption down to 189 μA/MHz and Static

power consumption down to 3.1 μA with full state retention

and 6 μs wakeup. Lowest Static mode down to 359 nA

MK11DX128AVLK5

MK11DX256AVLK5

MK11DN512AVLK5

80 QFP

12 x 12 x 1.6 mm Pitch 0.5 mm

Performance

• Up to 50 MHz ARM® Cortex®-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• Up to 512 KB of program flash

• Up to 64 KB RAM

• 64 KB FlexNVM and 4 KB FlexRAM on FlexMemory

devices

System peripherals

• Multiple low-power modes

• 16-channel DMA controller

• External watchdog monitor

• Software watchdog

Clocks

• 32 kHz and 3-32 MHz crystal oscillator

• Multipurpose clock generator

Security and integrity modules

• Hardware CRC module

• Tamper detect and secure storage

• Hardware random-number generator

• Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

• 128-bit unique identification (ID) number per chip

Communication interfaces

• Two SPI modules

• Two I2C modules

• Four UART modules

• I2S module

Timers

• 8-channel motor control/general purpose/PWM

timers

• Two 2-channel general purpose timers

• 32-bit PITs and 16-bit low-power timer

• Carrier modulator transmitter

• Real-time clock

• Programmable delay block

Analog modules

• 16-bit SAR ADC

• Two analog comparators (CMP)

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): –40 to 105°C

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 14

2.2.7 Designing with radiated emissions in mind..........15

2.2.8 Capacitance attributes.........................................15

2.3 Switching specifications...................................................15

2.3.1 Device clock specifications..................................15

2.3.2 General switching specifications......................... 16

2.4 Thermal specifications..................................................... 17

2.4.1 Thermal operating requirements......................... 17

2.4.2 Thermal attributes................................................17

3 Peripheral operating requirements and behaviors.................. 18

3.1 Core modules.................................................................. 18

3.1.1 JTAG electricals.................................................. 19

3.2 System modules.............................................................. 22

3.3 Clock modules................................................................. 22

3.3.1

3.3.2

3.3.3

MCG specifications..............................................22

Oscillator electrical specifications........................24

32 kHz oscillator electrical characteristics........... 26

3.6.1 ADC electrical specifications............................... 31

3.6.2 CMP and 6-bit DAC electrical specifications....... 36

3.7 Timers..............................................................................38

3.8 Communication interfaces............................................... 38

3.8.1 DSPI switching specifications (limited voltage

range).................................................................. 38

DSPI switching specifications (full voltage

range).................................................................. 40

3.8.3 I2C switching specifications.................................42

3.8.4 UART switching specifications............................ 42

3.8.5 I2S switching specifications.................................42

Dimensions............................................................................. 46

4.1 Obtaining package dimensions....................................... 46

Pinout...................................................................................... 46

5.1 K11 Signal Multiplexing and Pin Assignments.................46

5.2 K11 Pinouts..................................................................... 50

Ordering parts......................................................................... 51

6.1 Determining valid orderable parts....................................51

Part identification.....................................................................52

7.1 Description.......................................................................52

7.2 Format............................................................................. 52

7.3 Fields............................................................................... 52

7.4 Example...........................................................................53

7.5 Small package marking................................................... 53

8 Terminology and guidelines.................................................... 54

8.1 Definition: Operating requirement....................................54

8.2 Definition: Operating behavior......................................... 54

8.3 Definition: Attribute.......................................................... 55

8.4 Definition: Rating............................................................. 55

8.5 Result of exceeding a rating............................................ 56

8.6 Relationship between ratings and operating

requirements....................................................................56

8.7 Guidelines for ratings and operating requirements..........57

8.8 Definition: Typical value...................................................57

8.9 Typical value conditions.................................................. 58

9 Revision History...................................................................... 58

3.8.2

3.4 Memories and memory interfaces................................... 27

3.4.1 Flash electrical specifications.............................. 27

3.4.2 EzPort switching specifications........................... 30

3.5 Security and integrity modules........................................ 31

3.5.1 DryIce Tamper Electrical Specifications.............. 31

3.6 Analog............................................................................. 31