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51248-4798

产品描述IC u0026 Component Sockets 1.27MM 479P BGA MNT ZIF W/CVR
产品类别连接器   
文件大小31KB,共1页
制造商Molex
官网地址https://www.molex.com/molex/home
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51248-4798概述

IC u0026 Component Sockets 1.27MM 479P BGA MNT ZIF W/CVR

51248-4798规格参数

参数名称属性值
产品种类
Product Category
IC & Component Sockets
制造商
Manufacturer
Molex
RoHSDetails
产品
Product
Micro PGA Sockets
位置数量
Number of Positions
479 Position
节距
Pitch
1.27 mm
端接类型
Termination Style
SMD/SMT
主体材料
Contact Plating
Gold
触点材料
Contact Material
Copper, Nickel, Silicon
电流额定值
Current Rating
500 mA
FeaturesZIF, with pick and place cover; mates with Intel Mobile Celeron and Pentium 4 Processors
外壳材料
Housing Material
Thermoplastic
安装风格
Mounting Style
SMD/SMT
工厂包装数量
Factory Pack Quantity
300
电压额定值
Voltage Rating
100 V
单位重量
Unit Weight
0.314079 oz

文档预览

下载PDF文档
This document was generated on 05/26/2011
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Description:
0512484799
Active
1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)
Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tape and Reel Package, 0.25µm
(10µ") Gold (Au) Plating, Lead Free
Documents:
3D Model
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Series
General
Product Family
Series
Comments
Component Type
Product Name
Processor Sockets
51248
ZIF, with Pick and Place Cover
Socket
Micro PGA
image - Reference only
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Not Reviewed
Low-Halogen Status
Low-Halogen
China RoHS
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Packaging Type
Pitch - Mating Interface
Plating min - Mating
Plating min - Termination
Temperature Range - Operating
Termination Interface: Style
479
479
Black, Natural
50
Copper-Nickel-Silicon, Stainless Steel
Gold
Nickel
High Temperature Thermoplastic
Embossed Tape on Reel
1.27mm (.050")
0.254µm (10µ")
1.270µm (50µ")
-20°C to +90°C
Surface Mount
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Electrical
Current - Maximum per Contact
Voltage - Maximum
0.5A
100V
Search Parts in this Series
51248Series
Mates With
Intel Mobile Celeron* Processor-M|Intel
Mobile Pentium* 4 Processor
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
10
Reflow Capable (SMT only)
1
250
Material Info
* Pentium and Celeron are registered trademark of Intel Corporation
This document was generated on 05/26/2011
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

51248-4798相似产品对比

51248-4798 51248-4799
描述 IC u0026 Component Sockets 1.27MM 479P BGA MNT ZIF W/CVR IC u0026 Component Sockets 1.27MM 479P PGA SKT BGA MOUNT ZIF
产品种类
Product Category
IC & Component Sockets IC & Component Sockets
制造商
Manufacturer
Molex Molex
RoHS Details Details
产品
Product
Micro PGA Sockets Micro PGA Sockets
位置数量
Number of Positions
479 Position 479 Position
节距
Pitch
1.27 mm 1.27 mm
端接类型
Termination Style
SMD/SMT SMD/SMT
主体材料
Contact Plating
Gold Gold
触点材料
Contact Material
Copper, Nickel, Silicon Copper, Nickel, Silicon
电流额定值
Current Rating
500 mA 500 mA
Features ZIF, with pick and place cover; mates with Intel Mobile Celeron and Pentium 4 Processors ZIF, with pick and place cover; mates with Intel Mobile Celeron and Pentium 4 Processors
外壳材料
Housing Material
Thermoplastic Thermoplastic
安装风格
Mounting Style
SMD/SMT SMD/SMT
工厂包装数量
Factory Pack Quantity
300 480
电压额定值
Voltage Rating
100 V 100 V
单位重量
Unit Weight
0.314079 oz 0.314079 oz
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