51248-4799: 产品描述IC u0026 Component Sockets 1.27MM 479P PGA SKT BGA MOUNT ZIF; 产品类别连接器; 文件大小31KB，共1页; 制造商Molex; 官网地址https://www.molex.com/molex/home

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51248-4799概述

IC u0026 Component Sockets 1.27MM 479P PGA SKT BGA MOUNT ZIF

51248-4799规格参数

参数名称	属性值
产品种类 Product Category	IC & Component Sockets
制造商 Manufacturer	Molex
RoHS	Details
产品 Product	Micro PGA Sockets
位置数量 Number of Positions	479 Position
节距 Pitch	1.27 mm
端接类型 Termination Style	SMD/SMT
主体材料 Contact Plating	Gold
系列 Packaging	Cut Tape
系列 Packaging	Reel
触点材料 Contact Material	Copper, Nickel, Silicon
电流额定值 Current Rating	500 mA
Features	ZIF, with pick and place cover; mates with Intel Mobile Celeron and Pentium 4 Processors
外壳材料 Housing Material	Thermoplastic
安装风格 Mounting Style	SMD/SMT
工厂包装数量 Factory Pack Quantity	480
电压额定值 Voltage Rating	100 V
单位重量 Unit Weight	0.314079 oz

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This document was generated on 05/26/2011

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

Description:

0512484799

Active

1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)

Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tape and Reel Package, 0.25µm

(10µ") Gold (Au) Plating, Lead Free

Documents:

3D Model

Drawing (PDF)

RoHS Certificate of Compliance (PDF)

Series

General

Product Family

Series

Comments

Component Type

Product Name

Processor Sockets

51248

ZIF, with Pick and Place Cover

Socket

Micro PGA

image - Reference only

EU RoHS

ELV and RoHS

Compliant

REACH SVHC

Not Reviewed

Low-Halogen Status

Low-Halogen

China RoHS

Physical

Circuits (Loaded)

Circuits (maximum)

Color - Resin

Durability (mating cycles max)

Material - Metal

Material - Plating Mating

Material - Plating Termination

Material - Resin

Packaging Type

Pitch - Mating Interface

Plating min - Mating

Plating min - Termination

Temperature Range - Operating

Termination Interface: Style

479

Black, Natural

Copper-Nickel-Silicon, Stainless Steel

Gold

Nickel

High Temperature Thermoplastic

Embossed Tape on Reel

1.27mm (.050")

0.254µm (10µ")

1.270µm (50µ")

-20°C to +90°C

Surface Mount

Need more information on product

environmental compliance?

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Please visit the Contact Us section for any

non-product compliance questions.

Electrical

Current - Maximum per Contact

Voltage - Maximum

0.5A

100V

Search Parts in this Series

51248Series

Mates With

Intel Mobile Celeron* Processor-M|Intel

Mobile Pentium* 4 Processor

Solder Process Data

Duration at Max. Process Temperature (seconds)

Lead-free Process Capability

Max. Cycles at Max. Process Temperature

Process Temperature max. C

Reflow Capable (SMT only)

250

Material Info

* Pentium and Celeron are registered trademark of Intel Corporation

This document was generated on 05/26/2011

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

51248-4799相似产品对比

	51248-4799	51248-4798
描述	IC u0026 Component Sockets 1.27MM 479P PGA SKT BGA MOUNT ZIF	IC u0026 Component Sockets 1.27MM 479P BGA MNT ZIF W/CVR
产品种类 Product Category	IC & Component Sockets	IC & Component Sockets
制造商 Manufacturer	Molex	Molex
RoHS	Details	Details
产品 Product	Micro PGA Sockets	Micro PGA Sockets
位置数量 Number of Positions	479 Position	479 Position
节距 Pitch	1.27 mm	1.27 mm
端接类型 Termination Style	SMD/SMT	SMD/SMT
主体材料 Contact Plating	Gold	Gold
触点材料 Contact Material	Copper, Nickel, Silicon	Copper, Nickel, Silicon
电流额定值 Current Rating	500 mA	500 mA
Features	ZIF, with pick and place cover; mates with Intel Mobile Celeron and Pentium 4 Processors	ZIF, with pick and place cover; mates with Intel Mobile Celeron and Pentium 4 Processors
外壳材料 Housing Material	Thermoplastic	Thermoplastic
安装风格 Mounting Style	SMD/SMT	SMD/SMT
工厂包装数量 Factory Pack Quantity	480	300
电压额定值 Voltage Rating	100 V	100 V
单位重量 Unit Weight	0.314079 oz	0.314079 oz

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