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BR24G128FJ-3AGTE2

产品描述EEPROM EEPROM Serial-I2C 128Kb
产品类别存储    存储   
文件大小2MB,共40页
制造商ROHM(罗姆半导体)
官网地址https://www.rohm.com/
标准
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BR24G128FJ-3AGTE2概述

EEPROM EEPROM Serial-I2C 128Kb

BR24G128FJ-3AGTE2规格参数

参数名称属性值
是否Rohs认证符合
厂商名称ROHM(罗姆半导体)
包装说明LSOP,
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time11 weeks
Samacsys DescriptionROHM BR24G128FJ-3AGTE2, 128kbit EEPROM Memory 8-Pin SOP-J
其他特性SEATED HT-CALCULATED
最大时钟频率 (fCLK)1 MHz
JESD-30 代码R-PDSO-G8
长度4.9 mm
内存密度131072 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16KX8
封装主体材料PLASTIC/EPOXY
封装代码LSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, LOW PROFILE
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
座面最大高度1.65 mm
串行总线类型I2C
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.7 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3.9 mm
最长写入周期时间 (tWC)5 ms

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Datasheet
Serial EEPROM Series Standard EEPROM
I
2
C BUS EEPROM (2-Wire)
BR24Gxxx-3A (128K 256K 1M)
General Description
BR24Gxxx-3A is a serial EEPROM of I
2
C BUS Interface Method
Features
All controls available by 2 ports of serial clock(SCL) and
serial data(SDA)
Other devices than EEPROM can be connected to the
same port, saving microcontroller port
1.7V to 5.5V Single Power Source Operation most
suitable for battery use
1.7V to 5.5V wide limit of operating voltage, possible
1MHz operation
Page Write Mode useful for initial value write at factory
shipment
Self-timed Programming Cycle
Low Current Consumption
Prevention of Write Mistake
Write (Write Protect) Function added
Prevention of Write Mistake at Low Voltage
More than 1 million write cycles
More than 40 years data retention
Noise filter built in SCL / SDA terminal
Initial delivery state FFh
Packages
W(Typ) x D(Typ)x H(Max)
DIP-T8
9.30mm x 6.50mm x 7.10mm
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
SOP8
5.00mm x 6.20mm x 1.71mm
TSSOP-B8J
3.00mm x 4.90mm x 1.10mm
SOP-J8
4.90mm x 6.00mm x 1.65mm
MSOP8
2.90mm x 4.00mm x 0.90mm
SSOP-B8
3.00mm x 6.40mm x 1.35mm
VSON008X2030
2.00mm x 3.00mm x 0.60mm
Figure 1.
Page Write
Number of Pages
Product Number
64Byte
BR24G128-3A
BR24G256-3A
256Byte
BR24G1M-3A
BR24G128-3A
Capacity
Bit Format
Type
BR24G128-3A
BR24G128F-3A
BR24G128FJ-3A
BR24G128FV-3A
128kbit
16k×8
BR24G128FVT-3A
BR24G128FVJ-3A
BR24G128FVM-3A
BR24G128NUX-3A
1.7V to 5.5V
TSSOP-B8
TSSOP-B8J
MSOP8
VSON008X2030
Power Source
Voltage
Package
DIP-T8
SOP8
SOP-J8
SSOP-B8
Product structure:Silicon monolithic integrated circuit
○This
product has no designed protection against radioactive rays
.
www.rohm.com
TSZ02201-0R2R0G100020-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
1/36
18.Jun.2015 Rev.006
TSZ22111・14・001

BR24G128FJ-3AGTE2相似产品对比

BR24G128FJ-3AGTE2 BR24G256FVT-3AGE2 BR24G256F-3AGTE2 BR24G128F-3AGTE2 BR24G256FV-3AGTE2 BR24G128FV-3AGTE2 BR24G1M-3A BR24G1MF-3AGTE2
描述 EEPROM EEPROM Serial-I2C 128Kb SRAM 16Mb 3V 45ns 1M x 16 LP SRAM DC Power Connectors DC Power Plugs u0026 Audio Plugs Temperature Sensor Development Tools BME280 or SPI Temp Humidity Press. SNSR Multilayer Ceramic Capacitors MLCC - SMD/SMT 0603 22uF 6.3volts *Derate Voltage/Temp EEPROM I2C BUS 128K 16384 8bit EEPROM EEPROM Crystals 24MHz 200PPM Tol. AEC-Q200 CRYSTAL
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
包装说明 LSOP, TSSOP-8 SOP-8 SOP-8 SSOP-8 LSSOP, DIP, DIP8,.3 SOP-8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
最大时钟频率 (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
长度 4.9 mm 4.4 mm 5 mm 5 mm 4.4 mm 4.4 mm 9.3 mm 5 mm
内存密度 131072 bit 262144 bit 262144 bit 131072 bit 262144 bit 131072 bit 1048576 bit 1048576 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8
字数 16384 words 32768 words 32768 words 16384 words 32768 words 16384 words 131072 words 131072 words
字数代码 16000 32000 32000 16000 32000 16000 128000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 16KX8 32KX8 32KX8 16KX8 32KX8 16KX8 128KX8 128KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LSOP TSSOP SOP SOP LSSOP LSSOP DIP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
座面最大高度 1.65 mm 1.2 mm 1.71 mm 1.71 mm 1.35 mm 1.35 mm 3.7 mm 1.71 mm
串行总线类型 I2C I2C I2C I2C I2C I2C I2C I2C
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
表面贴装 YES YES YES YES YES YES NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING
端子节距 1.27 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3.9 mm 3 mm 4.4 mm 4.4 mm 3 mm 3 mm 7.62 mm 4.4 mm
最长写入周期时间 (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
厂商名称 ROHM(罗姆半导体) - - ROHM(罗姆半导体) - ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体)
Factory Lead Time 11 weeks 11 weeks 11 weeks 11 weeks 11 weeks 11 weeks - 11 weeks
其他特性 SEATED HT-CALCULATED - SEATED HT-CALCULATED SEATED HT-CALCULATED SEATED HT-CALCULATED SEATED HT-CALCULATED ROHM-S-A0000225889 REF SEATED HTCONSIDER SEATED HT-CALCULATED
Base Number Matches - 1 1 1 1 - - 1

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