EEPROM I2C BUS 128K 16384 8bit EEPROM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) |
| 包装说明 | LSSOP, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 11 weeks |
| 其他特性 | SEATED HT-CALCULATED |
| 最大时钟频率 (fCLK) | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.4 mm |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 座面最大高度 | 1.35 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| BR24G128FV-3AGTE2 | BR24G128FJ-3AGTE2 | BR24G256FVT-3AGE2 | BR24G256F-3AGTE2 | BR24G128F-3AGTE2 | BR24G256FV-3AGTE2 | BR24G1M-3A | BR24G1MF-3AGTE2 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM I2C BUS 128K 16384 8bit EEPROM | EEPROM EEPROM Serial-I2C 128Kb | SRAM 16Mb 3V 45ns 1M x 16 LP SRAM | DC Power Connectors DC Power Plugs u0026 Audio Plugs | Temperature Sensor Development Tools BME280 or SPI Temp Humidity Press. SNSR | Multilayer Ceramic Capacitors MLCC - SMD/SMT 0603 22uF 6.3volts *Derate Voltage/Temp | EEPROM | Crystals 24MHz 200PPM Tol. AEC-Q200 CRYSTAL |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | LSSOP, | LSOP, | TSSOP-8 | SOP-8 | SOP-8 | SSOP-8 | DIP, DIP8,.3 | SOP-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| 长度 | 4.4 mm | 4.9 mm | 4.4 mm | 5 mm | 5 mm | 4.4 mm | 9.3 mm | 5 mm |
| 内存密度 | 131072 bit | 131072 bit | 262144 bit | 262144 bit | 131072 bit | 262144 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 16384 words | 16384 words | 32768 words | 32768 words | 16384 words | 32768 words | 131072 words | 131072 words |
| 字数代码 | 16000 | 16000 | 32000 | 32000 | 16000 | 32000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16KX8 | 16KX8 | 32KX8 | 32KX8 | 16KX8 | 32KX8 | 128KX8 | 128KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSOP | TSSOP | SOP | SOP | LSSOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 1.35 mm | 1.65 mm | 1.2 mm | 1.71 mm | 1.71 mm | 1.35 mm | 3.7 mm | 1.71 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3.9 mm | 3 mm | 4.4 mm | 4.4 mm | 3 mm | 7.62 mm | 4.4 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 厂商名称 | ROHM(罗姆半导体) | ROHM(罗姆半导体) | - | - | ROHM(罗姆半导体) | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
| Factory Lead Time | 11 weeks | 11 weeks | 11 weeks | 11 weeks | 11 weeks | 11 weeks | - | 11 weeks |
| 其他特性 | SEATED HT-CALCULATED | SEATED HT-CALCULATED | - | SEATED HT-CALCULATED | SEATED HT-CALCULATED | SEATED HT-CALCULATED | ROHM-S-A0000225889 REF SEATED HTCONSIDER | SEATED HT-CALCULATED |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 | - | 1 |
嵌入式系统
DSP 与 ARM 处理器
嵌入式系统
电源技术
微控制器 MCU
工业自动化与控制
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
