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74HCT244D,653: 产品描述buffers & line drivers octal buffer 3-state; 产品类别逻辑逻辑; 文件大小139KB，共18页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HCT244D,653概述

buffers & line drivers octal buffer 3-state

74HCT244D,653规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SOP
包装说明	7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20
针数	20
制造商包装代码	SOT163-1
Reach Compliance Code	compliant
控制类型	ENABLE LOW
系列	HCT
JESD-30 代码	R-PDSO-G20
JESD-609代码	e4
长度	12.8 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.006 A
湿度敏感等级	1
位数	4
功能数量	2
端口数量	2
端子数量	20
最高工作温度	125 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP20,.4
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	5 V
Prop。Delay @ Nom-Sup	33 ns
传播延迟（tpd）	33 ns
认证状态	Not Qualified
座面最大高度	2.65 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	7.5 mm

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74HC244; 74HCT244

Octal buffer/line driver; 3-state

Rev. 4 — 24 September 2012

Product data sheet

1. General description

The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device

can be used as two 4-bit buffers or one 8-bit buffer. The device features two output

enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE

causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes

that enable the use of current limiting resistors to interface inputs to voltages in excess of

2. Features and benefits



Input levels:



For 74HC244: CMOS level



For 74HCT244: TTL level



Octal bus interface



Non-inverting 3-state outputs



Complies with JEDEC standard no. 7 A



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC244N

74HCT244N

74HC244D

74HCT244D

74HC244DB

74HCT244DB

74HC244PW

74HCT244PW

74HC244BQ

74HCT244BQ

40 C

to +125

C

40 C

to +125

C

TSSOP20

40 C

to +125

C

SSOP20

40 C

to +125

C

SO20

plastic small outline package; 20 leads;

body width 7.5 mm

plastic shrink small outline package; 20 leads;

body width 5.3 mm

plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

SOT163-1

SOT339-1

SOT360-1

40 C

to +125

C

Name

DIP20

Description

plastic dual in-line package; 20 leads (300 mil)

Version

SOT146-1

Type number

DHVQFN20 plastic dual-in-line compatible thermal enhanced

SOT764-1

very thin quad flat package; no leads; 20 terminals;

body 2.5



4.5



0.85 mm

74HCT244D,653相似产品对比

	74HCT244D,653	74HC244PW,118	74HC244D,652	74HC244BQ,115	74HCT244BQ,115	PT7V4050MKTGA17.920/17.920
描述	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buff/ldrvr 3st	buffers & line drivers octal buff/drvr 3st	buffers & line drivers octal buffer 3-state	Clock Generator,
包装说明	7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20	4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20	SOP, SOP20,.4	HVQCCN, LCC20,.1X.18,20	HVQCCN, LCC20,.1X.18,20	,
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	unknown
Brand Name	NXP Semiconductor	NXP Semiconduc	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-
是否Rohs认证	符合	符合	符合	符合	符合	-
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-
零件包装代码	SOP	TSSOP2	SOP	QFN	QFN	-
针数	20	20	20	20	20	-
制造商包装代码	SOT163-1	SOT360-1	SOT163-1	SOT764-1	SOT764-1	-
控制类型	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	-
系列	HCT	HC/UH	HC/UH	HC/UH	HCT	-
JESD-30 代码	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PQCC-N20	R-PQCC-N20	-
JESD-609代码	e4	e4	e4	e4	e4	-
长度	12.8 mm	6.5 mm	12.8 mm	4.5 mm	4.5 mm	-
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	-
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	-
最大I（ol）	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	-
湿度敏感等级	1	1	1	1	1	-
位数	4	4	4	4	4	-
功能数量	2	2	2	2	2	-
端口数量	2	2	2	2	2	-
端子数量	20	20	20	20	20	-
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	-
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	SOP	TSSOP	SOP	HVQCCN	HVQCCN	-
封装等效代码	SOP20,.4	TSSOP20,.25	SOP20,.4	LCC20,.1X.18,20	LCC20,.1X.18,20	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
封装形式	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-
包装方法	TAPE AND REEL	TAPE AND REEL	BULK PACK	TAPE AND REEL	TAPE AND REEL	-
峰值回流温度（摄氏度）	260	260	260	260	260	-
电源	5 V	2/6 V	2/6 V	2/6 V	5 V	-
Prop。Delay @ Nom-Sup	33 ns	-	33 ns	33 ns	33 ns	-
传播延迟（tpd）	33 ns	165 ns	165 ns	165 ns	33 ns	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
座面最大高度	2.65 mm	1.1 mm	2.65 mm	1 mm	1 mm	-
最大供电电压 (Vsup)	5.5 V	6 V	6 V	6 V	5.5 V	-
最小供电电压 (Vsup)	4.5 V	2 V	2 V	2 V	4.5 V	-
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	-
表面贴装	YES	YES	YES	YES	YES	-
技术	CMOS	CMOS	CMOS	CMOS	CMOS	-
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-
端子形式	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	-
端子节距	1.27 mm	0.65 mm	1.27 mm	0.5 mm	0.5 mm	-
端子位置	DUAL	DUAL	DUAL	QUAD	QUAD	-
处于峰值回流温度下的最长时间	30	30	30	30	30	-
宽度	7.5 mm	4.4 mm	7.5 mm	2.5 mm	2.5 mm	-

74HCT244D,653

74HCT244D,653概述

74HCT244D,653规格参数

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