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74HC244BQ,115

产品描述buffers & line drivers octal buff/drvr 3st
产品类别逻辑    逻辑   
文件大小139KB,共18页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74HC244BQ,115概述

buffers & line drivers octal buff/drvr 3st

74HC244BQ,115规格参数

参数名称属性值
Brand NameNXP Semiconductor
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码QFN
包装说明HVQCCN, LCC20,.1X.18,20
针数20
制造商包装代码SOT764-1
Reach Compliance Codecompliant
控制类型ENABLE LOW
系列HC/UH
JESD-30 代码R-PQCC-N20
JESD-609代码e4
长度4.5 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.006 A
湿度敏感等级1
位数4
功能数量2
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码HVQCCN
封装等效代码LCC20,.1X.18,20
封装形状RECTANGULAR
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源2/6 V
Prop。Delay @ Nom-Sup33 ns
传播延迟(tpd)165 ns
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度2.5 mm

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74HC244; 74HCT244
Octal buffer/line driver; 3-state
Rev. 4 — 24 September 2012
Product data sheet
1. General description
The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device
can be used as two 4-bit buffers or one 8-bit buffer. The device features two output
enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE
causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes
that enable the use of current limiting resistors to interface inputs to voltages in excess of
V
CC
.
2. Features and benefits
Input levels:
For 74HC244: CMOS level
For 74HCT244: TTL level
Octal bus interface
Non-inverting 3-state outputs
Complies with JEDEC standard no. 7 A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC244N
74HCT244N
74HC244D
74HCT244D
74HC244DB
74HCT244DB
74HC244PW
74HCT244PW
74HC244BQ
74HCT244BQ
40 C
to +125
C
40 C
to +125
C
TSSOP20
40 C
to +125
C
SSOP20
40 C
to +125
C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT163-1
SOT339-1
SOT360-1
40 C
to +125
C
Name
DIP20
Description
plastic dual in-line package; 20 leads (300 mil)
Version
SOT146-1
Type number
DHVQFN20 plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
4.5
0.85 mm

74HC244BQ,115相似产品对比

74HC244BQ,115 74HC244PW,118 74HC244D,652 74HCT244BQ,115 PT7V4050MKTGA17.920/17.920 74HCT244D,653
描述 buffers & line drivers octal buff/drvr 3st buffers & line drivers octal buffer 3-state buffers & line drivers octal buff/ldrvr 3st buffers & line drivers octal buffer 3-state Clock Generator, buffers & line drivers octal buffer 3-state
包装说明 HVQCCN, LCC20,.1X.18,20 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 SOP, SOP20,.4 HVQCCN, LCC20,.1X.18,20 , 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20
Reach Compliance Code compliant compli compliant compliant unknown compliant
Brand Name NXP Semiconductor NXP Semiconduc NXP Semiconductor NXP Semiconductor - NXP Semiconductor
是否Rohs认证 符合 符合 符合 符合 - 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦)
零件包装代码 QFN TSSOP2 SOP QFN - SOP
针数 20 20 20 20 - 20
制造商包装代码 SOT764-1 SOT360-1 SOT163-1 SOT764-1 - SOT163-1
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW - ENABLE LOW
系列 HC/UH HC/UH HC/UH HCT - HCT
JESD-30 代码 R-PQCC-N20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 - R-PDSO-G20
JESD-609代码 e4 e4 e4 e4 - e4
长度 4.5 mm 6.5 mm 12.8 mm 4.5 mm - 12.8 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF - 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER - BUS DRIVER
最大I(ol) 0.006 A 0.006 A 0.006 A 0.006 A - 0.006 A
湿度敏感等级 1 1 1 1 - 1
位数 4 4 4 4 - 4
功能数量 2 2 2 2 - 2
端口数量 2 2 2 2 - 2
端子数量 20 20 20 20 - 20
最高工作温度 125 °C 125 °C 125 °C 125 °C - 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C - -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE - 3-STATE
输出极性 TRUE TRUE TRUE TRUE - TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 HVQCCN TSSOP SOP HVQCCN - SOP
封装等效代码 LCC20,.1X.18,20 TSSOP20,.25 SOP20,.4 LCC20,.1X.18,20 - SOP20,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - SMALL OUTLINE
包装方法 TAPE AND REEL TAPE AND REEL BULK PACK TAPE AND REEL - TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 260 - 260
电源 2/6 V 2/6 V 2/6 V 5 V - 5 V
Prop。Delay @ Nom-Sup 33 ns - 33 ns 33 ns - 33 ns
传播延迟(tpd) 165 ns 165 ns 165 ns 33 ns - 33 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 1 mm 1.1 mm 2.65 mm 1 mm - 2.65 mm
最大供电电压 (Vsup) 6 V 6 V 6 V 5.5 V - 5.5 V
最小供电电压 (Vsup) 2 V 2 V 2 V 4.5 V - 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V - 5 V
表面贴装 YES YES YES YES - YES
技术 CMOS CMOS CMOS CMOS - CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD
端子形式 NO LEAD GULL WING GULL WING NO LEAD - GULL WING
端子节距 0.5 mm 0.65 mm 1.27 mm 0.5 mm - 1.27 mm
端子位置 QUAD DUAL DUAL QUAD - DUAL
处于峰值回流温度下的最长时间 30 30 30 30 - 30
宽度 2.5 mm 4.4 mm 7.5 mm 2.5 mm - 7.5 mm

 
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