AC SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 系列 | AC |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND GATE |
| 最大I（ol） | 0.024 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 0.04 mA |
| Prop。Delay @ Nom-Sup | 12.5 ns |
| 传播延迟（tpd） | 12.5 ns |
| 认证状态 | Qualified |
| 施密特触发器 | NO |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 5962-87615012X | 5962-8761501CX | 5962-8761501DX | SN54AC08FK | SN54AC08J | SN54AC08W | |
|---|---|---|---|---|---|---|
| 描述 | AC SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 | AC SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | AC SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14 | AC SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 | AC SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | AC SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, FP-14 |
| 零件包装代码 | QLCC | DIP | DFP | QLCC | DIP | DFP |
| 包装说明 | QCCN, | DIP, | DFP, | CERAMIC, LCC-20 | CERAMIC, DIP-14 | CERAMIC, FP-14 |
| 针数 | 20 | 14 | 14 | 20 | 14 | 14 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | unknown |
| 系列 | AC | AC | AC | AC | AC | AC |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T14 | R-GDFP-F14 | S-CQCC-N20 | R-GDIP-T14 | R-GDFP-F14 |
| 长度 | 8.89 mm | 19.56 mm | 9.21 mm | 8.89 mm | 19.56 mm | 9.21 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 14 | 14 | 20 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DIP | DFP | QCCN | DIP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 12.5 ns | 12.5 ns | 12.5 ns | 8.5 ns | 8.5 ns | 8.5 ns |
| 认证状态 | Qualified | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 8.89 mm | 7.62 mm | 6.29 mm | 8.89 mm | 7.62 mm | 6.29 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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