UVPROM, 128KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | QFJ |
| 包装说明 | WQCCN, LCC32,.45X.55 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 70 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-CQCC-N32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 128KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCN |
| 封装等效代码 | LCC32,.45X.55 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, WINDOW |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 3.556 mm |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| 5962-8961408MYA | 5962-8961408MXA | 890-90-034-20-905 | 5962-8961409MYA | 5962-8961407MYA | 5962-8961407MXA | |
|---|---|---|---|---|---|---|
| 描述 | UVPROM, 128KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | Board Connector, 34 Contact(s), 1 Row(s), Male, Right Angle, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle | UVPROM, 128KX8, 55ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 128KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 厂商名称 | AMD(超微) | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | QFJ | DIP | - | QFJ | QFJ | DIP |
| 包装说明 | WQCCN, LCC32,.45X.55 | WDIP, DIP32,.6 | - | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | WDIP, DIP32,.6 |
| 针数 | 32 | 32 | - | 32 | 32 | 32 |
| 最长访问时间 | 70 ns | 70 ns | - | 55 ns | 90 ns | 90 ns |
| I/O 类型 | COMMON | COMMON | - | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-CQCC-N32 | R-GDIP-T32 | - | R-CQCC-N32 | R-CQCC-N32 | R-GDIP-T32 |
| 长度 | 13.97 mm | 42.1005 mm | - | 13.97 mm | 13.97 mm | 42.1005 mm |
| 内存密度 | 1048576 bit | 1048576 bit | - | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | UVPROM | UVPROM | - | UVPROM | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | - | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | - | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | - | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | - | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 128KX8 | 128KX8 | - | 128KX8 | 128KX8 | 128KX8 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | WQCCN | WDIP | - | WQCCN | WQCCN | WDIP |
| 封装等效代码 | LCC32,.45X.55 | DIP32,.6 | - | LCC32,.45X.55 | LCC32,.45X.55 | DIP32,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | - | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 3.556 mm | 5.588 mm | - | 3.556 mm | 3.556 mm | 5.588 mm |
| 最大待机电流 | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.06 mA | 0.06 mA | - | 0.06 mA | 0.06 mA | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | - | YES | YES | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | - | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD | THROUGH-HOLE | - | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | QUAD | DUAL | - | QUAD | QUAD | DUAL |
| 宽度 | 11.43 mm | 15.24 mm | - | 11.43 mm | 11.43 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 |
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