board eval for ltc3576eufe
| DC1577A | LTC3576EUFE#PBF | LTC3576EUFE#TRPBF | LTC3576EUFE-1#TRPBF | LTC3576EUFE-1#PBF | |
|---|---|---|---|---|---|
| 描述 | board eval for ltc3576eufe | IC POWER MANAGER W/USB OTG 38QFN | IC POWER MANAGER W/USB OTG 38QFN | IC POWER MANAGER W/USB OTG 38QFN | IC POWER MANAGER W/USB OTG 38QFN |
| Brand Name | - | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | QFN | QFN | QFN | QFN |
| 包装说明 | - | HVQCCN, LCC38,.16X.24,16 | HVQCCN, LCC38,.16X.24,16 | HVQCCN, LCC38,.16X.24,16 | HVQCCN, LCC38,.16X.24,16 |
| 针数 | - | 38 | 38 | 38 | 38 |
| 制造商包装代码 | - | UFE | UFE | UFE | UFE |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | - | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | - | R-PQCC-N38 | R-PQCC-N38 | R-PQCC-N38 | R-PQCC-N38 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 |
| 长度 | - | 6 mm | 6 mm | 6 mm | 6 mm |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 信道数量 | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 38 | 38 | 38 | 38 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | - | LCC38,.16X.24,16 | LCC38,.16X.24,16 | LCC38,.16X.24,16 | LCC38,.16X.24,16 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.35 V | 4.35 V | 4.35 V | 4.35 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
| 端子位置 | - | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 |
| 宽度 | - | 4 mm | 4 mm | 4 mm | 4 mm |
| 厂商名称 | - | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
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