Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56
参数名称 | 属性值 |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 56 |
Reach Compliance Code | unknown |
系列 | FCT |
JESD-30 代码 | R-GDFP-F56 |
JESD-609代码 | e0 |
逻辑集成电路类型 | BUS DRIVER |
位数 | 10 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 56 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 20 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | FLAT |
端子位置 | DUAL |
Base Number Matches | 1 |
5962-9228202MXX | 5962-9228201MXA | 5962-9228203MXX | 5962-9226801MXA | 5962-9226803MXA | 5962-9226802MXX | 5962-9226801MXX | 5962-9226803MXX | 5962-9226802MXA | 5962-9228201MXX | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56 | CPACK-56, Tube | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56 | CPACK-56, Tube | CPACK-56, Tube | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, CERPACK-56 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, CERPACK-56 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, CERPACK-56 | CPACK-56, Tube | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56 |
零件包装代码 | DFP | CPACK | DFP | CPACK | CPACK | DFP | DFP | DFP | CPACK | DFP |
包装说明 | DFP, | FP-56 | DFP, | CERPACK-56 | DFP, | DFP, | DFP, | DFP, FL56,.4,25 | CERPACK-56 | DFP, |
针数 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
Reach Compliance Code | unknown | not_compliant | unknown | not_compliant | not_compliant | unknown | unknown | unknown | not_compliant | unknown |
系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
传播延迟(tpd) | 20 ns | 20 ns | 20 ns | 13 ns | 6.8 ns | 10.5 ns | 13 ns | 6.8 ns | 10.5 ns | 20 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
筛选级别 | - | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
端子节距 | - | 0.635 mm | - | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | - |
长度 | - | - | - | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | - |
座面最大高度 | - | - | - | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | - |
宽度 | - | - | - | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved