CPACK-56, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CPACK |
| 包装说明 | CERPACK-56 |
| 针数 | 56 |
| 制造商包装代码 | CS56 |
| Reach Compliance Code | not_compliant |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F56 |
| JESD-609代码 | e0 |
| 长度 | 18.415 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 56 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 10.5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.413 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 9.652 mm |
| Base Number Matches | 1 |
| 5962-9226802MXA | 5962-9228201MXA | 5962-9228202MXX | 5962-9228203MXX | 5962-9226801MXA | 5962-9226803MXA | 5962-9226802MXX | 5962-9226801MXX | 5962-9226803MXX | 5962-9228201MXX | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | CPACK-56, Tube | CPACK-56, Tube | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56 | CPACK-56, Tube | CPACK-56, Tube | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, CERPACK-56 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, CERPACK-56 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, CERPACK-56 | Bus Driver, FCT Series, 2-Func, 10-Bit, True Output, CMOS, CDFP56, FP-56 |
| 零件包装代码 | CPACK | CPACK | DFP | DFP | CPACK | CPACK | DFP | DFP | DFP | DFP |
| 包装说明 | CERPACK-56 | FP-56 | DFP, | DFP, | CERPACK-56 | DFP, | DFP, | DFP, | DFP, FL56,.4,25 | DFP, |
| 针数 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant | unknown | unknown | unknown | unknown |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 传播延迟（tpd） | 10.5 ns | 20 ns | 20 ns | 20 ns | 13 ns | 6.8 ns | 10.5 ns | 13 ns | 6.8 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 长度 | 18.415 mm | - | - | - | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | - | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
| 座面最大高度 | 2.413 mm | - | - | - | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | - |
| 端子节距 | 0.635 mm | 0.635 mm | - | - | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | - |
| 宽度 | 9.652 mm | - | - | - | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | - |
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