RISC Microcontroller, 32-Bit, 133MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 |
针数 | 208 |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A001.A.3 |
具有ADC | NO |
地址总线宽度 | 32 |
位大小 | 32 |
最大时钟频率 | 66.66 MHz |
DAC 通道 | NO |
DMA 通道 | YES |
外部数据总线宽度 | 32 |
JESD-30 代码 | S-PQFP-G208 |
JESD-609代码 | e0 |
长度 | 28 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 8 |
端子数量 | 208 |
最高工作温度 | 85 °C |
最低工作温度 | |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FQFP |
封装等效代码 | QFP208,1.2SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, FINE PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 4.1 mm |
速度 | 133 MHz |
最大压摆率 | 630 mA |
最大供电电压 | 3.465 V |
最小供电电压 | 3.135 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 28 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
Base Number Matches | 1 |
IDT79RC32V332-133DH | IDT79RC32T332-100DHI | IDT79RC32T332-150DH | IDT79RC32V332-100DH | IDT79RC32V332-150DH | |
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描述 | RISC Microcontroller, 32-Bit, 133MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | Microprocessor, 32-Bit, 100MHz, CMOS, PQFP208 | Microprocessor, 32-Bit, 150MHz, CMOS, PQFP208 | RISC Microcontroller, 32-Bit, 100MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | Microprocessor, 32-Bit, 150MHz, CMOS, PQFP208 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
位大小 | 32 | 32 | 32 | 32 | 32 |
JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 208 | 208 | 208 | 208 | 208 |
最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FQFP | QFP | QFP | FQFP | QFP |
封装等效代码 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, FINE PITCH | FLATPACK | FLATPACK | FLATPACK, FINE PITCH | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED | 225 | 225 | 225 | 225 |
电源 | 3.3 V | 2.5,3.3 V | 2.5,3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
速度 | 133 MHz | 100 MHz | 150 MHz | 100 MHz | 150 MHz |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | INDUSTRIAL | COMMERCIAL | OTHER | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROPROCESSOR | MICROPROCESSOR | MICROCONTROLLER, RISC | MICROPROCESSOR |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
最大压摆率 | 630 mA | - | - | 480 mA | 700 mA |
标称供电电压 | 3.3 V | - | - | 3.3 V | 3.3 V |
是否无铅 | - | 含铅 | 含铅 | - | 含铅 |
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