Microprocessor, 32-Bit, 100MHz, CMOS, PQFP208
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| 位大小 | 32 |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 3 |
| 端子数量 | 208 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP208,1.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 2.5,3.3 V |
| 认证状态 | Not Qualified |
| 速度 | 100 MHz |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
| Base Number Matches | 1 |
| IDT79RC32T332-100DHI | IDT79RC32V332-133DH | IDT79RC32T332-150DH | IDT79RC32V332-100DH | IDT79RC32V332-150DH | |
|---|---|---|---|---|---|
| 描述 | Microprocessor, 32-Bit, 100MHz, CMOS, PQFP208 | RISC Microcontroller, 32-Bit, 133MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | Microprocessor, 32-Bit, 150MHz, CMOS, PQFP208 | RISC Microcontroller, 32-Bit, 100MHz, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 | Microprocessor, 32-Bit, 150MHz, CMOS, PQFP208 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 位大小 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 208 | 208 | 208 | 208 | 208 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | FQFP | QFP | FQFP | QFP |
| 封装等效代码 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK, FINE PITCH | FLATPACK | FLATPACK, FINE PITCH | FLATPACK |
| 峰值回流温度（摄氏度） | 225 | NOT SPECIFIED | 225 | 225 | 225 |
| 电源 | 2.5,3.3 V | 3.3 V | 2.5,3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 速度 | 100 MHz | 133 MHz | 150 MHz | 100 MHz | 150 MHz |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | OTHER | COMMERCIAL | OTHER | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROCONTROLLER, RISC | MICROPROCESSOR | MICROCONTROLLER, RISC | MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 含铅 | - | 含铅 | - | 含铅 |
| 最大压摆率 | - | 630 mA | - | 480 mA | 700 mA |
| 标称供电电压 | - | 3.3 V | - | 3.3 V | 3.3 V |
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