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CAT1024RD2I-30TE13

产品描述Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8
产品类别电源/电源管理    电源电路   
文件大小110KB,共17页
制造商Catalyst
官网地址http://www.catalyst-semiconductor.com/
下载文档 详细参数 选型对比 全文预览 文档解析

CAT1024RD2I-30TE13概述

Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8

CAT1024RD2I-30TE13规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码SON
包装说明HVSON,
针数8
Reach Compliance Codeunknow
ECCN代码EAR99
可调阈值NO
模拟集成电路 - 其他类型POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码R-XDSO-N8
JESD-609代码e0
长度4.9 mm
湿度敏感等级1
信道数量1
功能数量1
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码HVSON
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)240
认证状态Not Qualified
座面最大高度0.8 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式NO LEAD
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3 mm
Base Number Matches1

文档解析

CAT1024 和 CAT1025 是高度集成的监控电路与串行 EEPROM 解决方案,专为微控制器基础系统设计。这些设备将 2k-bit CMOS EEPROM 内存与精密电源监控功能结合在一个芯片中,采用低功耗 CMOS 技术,通过 400kHz I2C 总线接口实现数据通信。电源监控部分提供 brown-out 保护,确保系统在电源上电、下电和电压不足条件下稳定运行,有效防止数据损坏和系统故障。 关键特性包括 16 字节页写缓冲区,支持高效数据写入;内置写保护机制(仅 CAT1025),通过 WP 引脚防止意外写入;100 万次程序/擦除周期和 100 年数据保留,保证长期可靠性。设备支持手动重置输入(MR),允许外部触发重置条件,并提供主动高或低重置输出(RESET 和 RESET),在 VCC 低于阈值电压时激活。电源监控支持 5V、3.3V 和 3V 系统,有五个阈值电压选项(4.50V-4.75V、4.25V-4.50V、3.00V-3.15V、2.85V-3.00V、2.55V-2.70V),操作电压范围 2.7V 至 5.5V。 应用领域包括工业控制、汽车电子、消费设备和通信系统,其中集成设计减少了外部组件,降低系统复杂度和成本。可用封装有 8-pin DIP、SOIC、TSSOP、MSOP 和 TDFN(3x3mm 或 3x4.9mm footprint),温度范围覆盖工业级(-40°C 至 85°C)和扩展级(-40°C 至 125°C),适应各种环境需求。

文档预览

下载PDF文档
Preliminary Information
CAT1024, CAT1025
Supervisory Circuits with I
2
C Serial 2k-bit CMOS EEPROM and Manual Reset
FEATURES
s
Precision power supply voltage monitor
s
16-Byte page write buffer
H
GEN
FR
ALO
EE
LE
A
D
F
R
E
E
TM
s
Built-in inadvertent write protection
— 5V, 3.3V and 3V systems
— Five threshold voltage options
s
Active high or low reset
— WP pin (CAT1025)
s
1,000,000 Program/Erase cycles
s
Manual reset input
s
100 year data retention
s
8-pin DIP, SOIC, TSSOP, MSOP & TDFN
— Valid reset guaranteed at V
CC
= 1V
s
400kHz I
2
C bus
s
2.7V to 5.5V operation
s
Low power CMOS technology
(3x4.9mm & 3x3mm foot print) packages
s
Industrial and extended temperature ranges
DESCRIPTION
The CAT1024 and CAT1025 are complete memory and
supervisory solutions for microcontroller-based systems.
A 2k-bit serial EEPROM memory and a system power
supervisor with brown-out protection are integrated
together in low power CMOS technology. Memory
interface is via a 400kHz I
2
C bus.
The CAT1025 provides a precision V
CC
sense circuit
and two open drain outputs: one (RESET) drives high
and the other (RESET) drives low whenever V
CC
falls
below the reset threshold voltage. The CAT1025 also
has a Write Protect input (WP). Write operations are
disabled if WP is connected to a logic high.
The CAT1024 also provides a precision V
CC
sense
circuit, but has only a
RESET
output and does not have
a Write Protect input.
The power supply monitor and reset circuit protect
memory and system controllers during power up/down
and against brownout conditions. Five reset threshold
voltages support 5V, 3.3V and 3V systems. If power supply
voltages are out of tolerance reset signals become active,
preventing the system microcontroller, ASIC or peripherals
from operating. Reset signals become inactive typically 200
ms after the supply voltage exceeds the reset threshold
level. With both active high and low reset signals, interface
to microcontrollers and other ICs is simple. In addition, the
RESET
pin or a separate input,
MR,
can be used as an input
for push-button manual reset capability.
The CAT1024/25 memory features a 16-byte page. In
addition, hardware data protection is provided by a V
CC
sense circuit that prevents writes to memory whenever V
CC
falls below the reset threshold or until V
CC
reaches the reset
threshold during power up.
Available packages include an 8-pin DIP and a surface
mount 8-pin SO, 8-pin TSSOP, 8-pin TDFN and 8-pin MSOP
packages. The TDFN package thickness is 0.8mm maximum.
TDFN footprint options are 3x3mm or 3x4.9mm (MSOP pad
layout).
PIN CONFIGURATION
DIP Package (P, L)
SOIC Package (S, V)
TSSOP Package (U, Y)
MSOP Package (R, Z)
MR
1
RESET
2
NC 3
VSS 4
CAT1024
8 VCC
7 NC
6 SCL
5 SDA
(Bottom View)
(Bottom View)
TDFN Package: 3mm x 3mm
TDFN Package: 3mm x 4.9mm
0.8mm maximum height - (RD2, ZD2) 0.8mm maximum height - (RD4, ZD4)
VCC
NC
SCL
SDA
8
7
1
2
MR
RESET
NC
VSS
VCC
NC
SCL
SDA
8
7
1
2
MR
RESET
NC
VSS
CAT1024
6
5
CAT1024
6
5
3
4
3
4
MR
1
RESET
2
RESET 3
VSS 4
CAT1025
8 VCC
7 WP
6 SCL
5 SDA
VCC
WP
SCL
SDA
8
7
1
2
MR
RESET
RESET
VSS
VCC
8
WP
7
SCL
6
SDA
5
1
MR
2
RESET
CAT1025
6
5
3
4
CAT1025
3
RESET
4
V
SS
© 2003 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Doc No. 3008, Rev. I

CAT1024RD2I-30TE13相似产品对比

CAT1024RD2I-30TE13 CAT1024RD2I-45TE13 CAT1025RD2E-25TE13 CAT1025RD2I-25TE13 CAT1024RD2I-42TE13 CAT1025RD2E-28TE13 CAT1025RD2E-42TE13 CAT1024RD2I-28TE13 CAT1024ZD2E-45TE13
描述 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8 Power Supply Support Circuit, Fixed, 1 Channel, CMOS, LEAD AND HALOGEN FREE, 3 X 4.90 MM, 0.80 MM HEIGHT, MO-229, TDFN-8
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 符合
零件包装代码 SON SON SON SON SON SON SON SON SON
包装说明 HVSON, HVSON, HVSON, HVSON, HVSON, HVSON, HVSON, HVSON, HVSON,
针数 8 8 8 8 8 8 8 8 8
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknow unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
可调阈值 NO NO NO NO NO NO NO NO NO
模拟集成电路 - 其他类型 POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8 R-XDSO-N8
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e3
长度 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm
湿度敏感等级 1 1 1 1 1 1 1 1 1
信道数量 1 1 1 1 1 1 1 1 1
功能数量 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8 8
最高工作温度 85 °C 85 °C 125 °C 85 °C 85 °C 125 °C 125 °C 85 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 HVSON HVSON HVSON HVSON HVSON HVSON HVSON HVSON HVSON
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) 240 240 240 240 240 240 240 240 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 5 V 3 V 3 V 5 V 3.3 V 5 V 3.3 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD Matte Tin (Sn)
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30 40
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Base Number Matches 1 1 1 1 1 1 1 1 1

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