Datasheet> 器件分类 > 模拟混合信号IC> 信号电路> 74HC1G66GW,165

文档预览

74HC1G66GW,165: 产品描述IC switch spst 5tssop; 产品类别模拟混合信号IC 信号电路; 文件大小107KB，共18页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

下载文档详细参数选型对比全文预览

74HC1G66GW,165概述

IC switch spst 5tssop

74HC1G66GW,165规格参数

参数名称	属性值
Source Url Status Check Date	2013-06-14 00:00:00
Brand Name	NXP Semiconduc
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP
包装说明	1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5
针数	5
制造商包装代码	SOT353-1
Reach Compliance Code	unknow
模拟集成电路 - 其他类型	SPST
JESD-30 代码	R-PDSO-G5
JESD-609代码	e3
长度	2 mm
湿度敏感等级	1
正常位置	NO
信道数量	1
功能数量	1
端子数量	5
标称断态隔离度	50 dB
最大通态电阻 (Ron)	142 Ω
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP5/6,.08
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	2/6 V
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	10 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
最长断开时间	45 ns
最长接通时间	30 ns
切换	MAKE-BEFORE-BREAK
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	Tin (Sn)
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	1.25 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

74HC1G66; 74HCT1G66

Single-pole single-throw analog switch

Rev. 04 — 19 December 2008

Product data sheet

1. General description

74HC1G66 and 74HCT1G66 are high-speed Si-gate CMOS devices. They are single-pole

single-throw analog switches. The switch has two input/output pins (Y and Z) and an

active HIGH enable input pin (E). When pin E is LOW, the analog switch is turned off.

The non-standard output currents are equal to those of the 74HC4066 and 74HCT4066.

2. Features

Wide supply voltage range from 2.0 V to 10.0 V for the 74HC1G66

Very low ON resistance:

Ω

(typ.) at V

= 4.5 V

Ω

(typ.) at V

= 6.0 V

Ω

(typ.) at V

= 9.0 V

High noise immunity

Low power dissipation

Multiple package options

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC1G66GW

74HCT1G66GW

74HC1G66GV

74HCT1G66GV

−40 °C

to +125

°C

SC-74A

−40 °C

to +125

°C

Name

TSSOP5

Description

plastic thin shrink small outline package;

5 leads; body width 1.25 mm

plastic surface-mounted package; 5 leads

Version

SOT353-1

SOT753

Type number

74HC1G66GW,165相似产品对比

	74HC1G66GW,165	74HCT1G66GW-G	74HCT1G66GW,165	74HCT1G66GW-T	74HC1G66GW-G	74HC1G66GW-T
描述	IC switch spst 5tssop	数字总线开关 IC single bilateral swt	IC switch spst 5tssop	IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch	IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch	IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch
零件包装代码	TSSOP	TSSOT	TSSOP	TSSOT	TSSOT	TSSOT
包装说明	1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5	1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5	1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5	1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5	1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5	TSSOP,
针数	5	5	5	5	5	5
Reach Compliance Code	unknow	unknow	unknown	unknown	unknown	unknown
模拟集成电路 - 其他类型	SPST	SPST	SPST	SPST	SPST	SPST
JESD-30 代码	R-PDSO-G5	R-PDSO-G5	R-PDSO-G5	R-PDSO-G5	R-PDSO-G5	R-PDSO-G5
长度	2 mm	2 mm	2 mm	2 mm	2 mm	2 mm
信道数量	1	1	1	1	1	1
功能数量	1	1	1	1	1	1
端子数量	5	5	5	5	5	5
标称断态隔离度	50 dB	50 dB	50 dB	50 dB	50 dB	50 dB
最大通态电阻 (Ron)	142 Ω	142 Ω	142 Ω	142 Ω	142 Ω	142 Ω
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm
最大供电电压 (Vsup)	10 V	5.5 V	5.5 V	5.5 V	10 V	10 V
最小供电电压 (Vsup)	2 V	4.5 V	4.5 V	4.5 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
最长断开时间	45 ns	53 ns	53 ns	53 ns	45 ns	45 ns
最长接通时间	30 ns	36 ns	36 ns	36 ns	30 ns	30 ns
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	1.25 mm	1.25 mm	1.25 mm	1.25 mm	1.25 mm	1.25 mm
Base Number Matches	1	1	1	1	1	1
是否Rohs认证	符合	符合	符合	符合	符合	-
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)
JESD-609代码	e3	e3	e3	e3	e3	-
湿度敏感等级	1	1	1	1	1	-
正常位置	NO	NO	NO	-	NO	-
封装等效代码	TSSOP5/6,.08	TSSOP5/6,.08	TSSOP5/6,.08	-	TSSOP5/6,.08	-
峰值回流温度（摄氏度）	260	260	260	260	260	-
电源	2/6 V	5 V	5 V	-	2/6 V	-
切换	MAKE-BEFORE-BREAK	MAKE-BEFORE-BREAK	MAKE-BEFORE-BREAK	-	MAKE-BEFORE-BREAK	-
端子面层	Tin (Sn)	TIN	Tin (Sn)	TIN	TIN	-
处于峰值回流温度下的最长时间	40	30	30	30	40	-

74HC1G66GW,165

74HC1G66GW,165概述

74HC1G66GW,165规格参数

文档预览

74HC1G66GW,165相似产品对比

推荐资源