IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOT |
| 包装说明 | TSSOP, |
| 针数 | 5 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G5 |
| 长度 | 2 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 标称断态隔离度 | 50 dB |
| 最大通态电阻 (Ron) | 142 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 10 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 最长断开时间 | 45 ns |
| 最长接通时间 | 30 ns |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 1.25 mm |
| Base Number Matches | 1 |

| 74HC1G66GW-T | 74HCT1G66GW-G | 74HC1G66GW,165 | 74HCT1G66GW,165 | 74HCT1G66GW-T | 74HC1G66GW-G | |
|---|---|---|---|---|---|---|
| 描述 | IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch | 数字总线开关 IC single bilateral swt | IC switch spst 5tssop | IC switch spst 5tssop | IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch | IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5, Multiplexer or Switch |
| 零件包装代码 | TSSOT | TSSOT | TSSOP | TSSOP | TSSOT | TSSOT |
| 包装说明 | TSSOP, | 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 | 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 | 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 | 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 | 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| 长度 | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 | 5 |
| 标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| 最大通态电阻 (Ron) | 142 Ω | 142 Ω | 142 Ω | 142 Ω | 142 Ω | 142 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 10 V | 5.5 V | 10 V | 5.5 V | 5.5 V | 10 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 45 ns | 53 ns | 45 ns | 53 ns | 53 ns | 45 ns |
| 最长接通时间 | 30 ns | 36 ns | 30 ns | 36 ns | 36 ns | 30 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 |
| 正常位置 | - | NO | NO | NO | - | NO |
| 封装等效代码 | - | TSSOP5/6,.08 | TSSOP5/6,.08 | TSSOP5/6,.08 | - | TSSOP5/6,.08 |
| 峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 | 260 |
| 电源 | - | 5 V | 2/6 V | 5 V | - | 2/6 V |
| 切换 | - | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | - | MAKE-BEFORE-BREAK |
| 端子面层 | - | TIN | Tin (Sn) | Tin (Sn) | TIN | TIN |
| 处于峰值回流温度下的最长时间 | - | 30 | 40 | 30 | 30 | 40 |
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