电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1210A122M2XAH7210

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BX, -/+15ppm/Cel TC, 0.0012uF, 1210,
产品类别无源元件    电容器   
文件大小160KB,共8页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1210A122M2XAH7210概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BX, -/+15ppm/Cel TC, 0.0012uF, 1210,

C1210A122M2XAH7210规格参数

参数名称属性值
是否Rohs认证不符合
Objectid926489214
包装说明, 1210
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL7.88
电容0.0012 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.6 mm
JESD-609代码e0
长度3.07 mm
多层Yes
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法TR, Plastic, 13 Inch
正容差20%
额定(直流)电压(URdc)200 V
系列C1210(BX,200V)
尺寸代码1210
温度特性代码BX
温度系数15% ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
宽度2.56 mm

文档预览

下载PDF文档
CERAMIC HIGH RELIABILITY
GENERAL INFORMATION GR900 SERIES
HIGH RELIABILITY — GR900
GR900 capacitors are intended for use in any application where
the chance of failure must be reduced to the lowest possible
level. While any well-made multilayer ceramic capacitor is an
inherently reliable device, GR900 capacitors receive special
attention in all phases of manufacture including:
— Raw Materials Selection
— Special Designs
— Clean Room Production
— Individual Batch Testing
— C-SAM (when applicable)
— Singular Batch Identity is Maintained
— Destructive Physical Analysis
These parts are well worth the added investment in comparison
to the cost of a device or system failure.
Typical applications include:
Medical, Aerospace, Communication Satellites, Radar, Guidance
Systems.
SCREENING AND SAMPLE TESTS
Each batch receives the following testing/inspections:
Preliminary:
1. Destructive Physical Analysis: (DPA) - A sample is pulled from
each lot and examined per EIA-469 and KEMET’s strict internal
void and delamination criteria. Sampling plan is per MIL-PRF-123.
2. C-SAM - May be performed on batches failing to meet the
DPA criteria for removal of marginal product. Not required on
each lot.
Group A
1. Thermal Shock
— Materials used in the construction of mul-
tilayer ceramic capacitors possess various thermal coefficients of
expansion. To assure maximum uniformity, each part is temper-
ature cycled in accordance to MIL-STD-202, Method 107,
Condition A with Step 3 being 125°C. Number of cycles shall be
20 (100% of lot).
2. Voltage Conditioning
— One of the most strenuous environ-
ments for any capacitor is the high temperature/high voltage test.
All units are subject to twice-rated voltage to the units at the max-
imum rated temperature of 125°C for a minimum of 168 hours
and a maximum of 264 hours. The voltage conditioning may be
terminated at any time during 168 hours to 264 hours time inter-
val that confirmed failures meet the requirements of the PDA dur-
ing the last 48 hours of 1 unit or .4% (100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning)
— All conditions of the standard voltage condi-
tioning apply with the exception of increased voltage and
decreased test time. Refer to MIL-PRF-123 for the proper formula.
*Step 5 is performed on chips at this point (100% of lot).
3. Dielectric Withstanding Voltage
— 250% of the dc rated volt-
age at 25°C (100% of lot).
4. Insulation Resistance
— The 25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 megohm-
microfarads (100% of lot).
*5. Insulation Resistance
— The 125°C measurement with
rated voltage applied shall be the lesser of 10 GΩ or 100
megohm-microfarads (100% of lot). For chips, 125°C IR is per-
formed prior to Step 3 above.
6. Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (temperature
characteristic BX only).
7. Capacitance
— Shall be within specified tolerance at 25°C
(100% of lot). (Aging phenomenon is taken into account for BX
dielectric to obtain capacitance.)
8. Dissipation Factor
— Shall not exceed 2.5% for X7R (BX)
dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)
9. Percent Defective Allowable (PDA)
— The overall PDA is 8%
for parts outside the MIL-PRF-123 values. The PDA is per MIL-
PRF-123 for all parts that are valid MIL-PRF-123 values. The PD
includes steps 1 through 8 above with the following exceptions.
Capacitance exclusion - capacitance values no more than 5% or
.5pF, whichever is greater for BX characteristic or 1% or .3pF,
whichever is greater for BP characteristic beyond specified toler-
ance limit, shall be removed from the lot but shall not be consid-
ered defective for determination of the PD.
Insulation Resistance at 25°C — Product which is not acceptable
for twice the military limit but is acceptable per the military limit,
is removed from the lot but shall not be considered defective for
determination of the PD.
10. Visual and Mechanical Examination
— Performed per MIL-
PRF-123 criteria.
11. Radiographic Examination (Leaded Devices Only)
Radial devices receive a one-plane X-ray.
12. Destructive Physical Analysis (DPA)
— A sample is exam-
ined on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.
STANDARD PACKAGING
All products are packaged in trays except C512 capacitors which
are packaged 1 piece per bag.
DATA PACKAGE
A data package is sent with each shipment which contains:
1.
Final Destructive Physical Analysis (DPA) report.
2.
Certificate of Compliance stating that the parts meet all applic-
able requirements of the appropriate military specification to the
best failure level to which KEMET is approved.
3.
Summary of Group A Testing.
12
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
【Altera SoC】HPS是什么?包括哪些内容?
最近在考虑这样的一个问题,HPS到底是什么东西,它包含哪些内容 通过查阅资料《Cyclone V Device Overview 》,有以下理解: 1、HPS:Hard processor system 字面意思就是硬件处理器系 ......
chenzhufly FPGA/CPLD
TI LMH6881 1GHz全差分可编放大器解决方案
TI公司的LMH6881是全差分可编高速放大器,工作频率高达1GHz, 100Ω输入,低阻抗输出,增益数字控制,从6dB到26dB,小信号带宽2400MHz,100MHz时的OIP3为44dBm, HD3为-100dBc,噪音为9.7dB,主要用在示波 ......
qwqwqw2088 模拟与混合信号
怎么克服拖延症?
你是否想过那些让你遗憾的未完成的事情?塞满硬盘的那些没看过的电影、书架上落满灰尘的书籍、因为各种原因推迟的老朋友聚会等等,你想象着终有一天会将它们一一完成,可是却发现积累的事情越来 ......
Benjoy 聊聊、笑笑、闹闹
MATLAB(ccslink)调试DSP中OOSLink连接对象控制
在MATLAB环境下,可以控制CCS IDE中程序的显示及断点的设置,并控制程序代码的执行和暂停,读写DSP的内存变量。例如,执行以下程序: open(ce,‘fir.C’,‘text’) %在CCS ......
fish001 DSP 与 ARM 处理器
STM32F10x在线调试,在USB_init()里面一直死循环
用的ST-link的debugger,用的demo程序改写,当在线调试的时候,在usb_init()里面一直死循环,在不断的运行NOP_Process(); Bus Hound 里面显示no respond, no device。 但是把程序烧进 ......
dhiway stm32/stm8
电脑没有串并口?
搞电子的,串并口是常用到的接口。并口仿真下载器一般价格比USB口的便宜上不少,电路相对也比较简单。串口是下位机与PC通信的过去和现在,USB是现在和未来,无论从硬件还是软件,串口通信都要比 ......
David_Lee 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1477  1413  156  1012  556  30  29  4  21  12 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved