Standard SRAM, 16X4, TTL, CDIP16,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 湿度敏感等级 | 2A |
| 端子数量 | 16 |
| 字数 | 16 words |
| 字数代码 | 16 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 16X4 |
| 输出特性 | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 250 |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 54LS89DM | 54LS89FM | 7489PC | 74LS89DC | 74LS89FC | 74LS89PC | 7489FC | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 16X4, TTL, CDIP16, | Standard SRAM, 16X4, TTL, CDFP16, | Standard SRAM, 16X4, 60ns, TTL, PDIP16, | Standard SRAM, 16X4, TTL, CDIP16, | Standard SRAM, 16X4, TTL, CDFP16, | Standard SRAM, 16X4, TTL, PDIP16, | Standard SRAM, 16X4, 60ns, TTL, CDFP16, |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 代码 | R-XDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-XDFP-F16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 湿度敏感等级 | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DFP | DIP | DIP | DFP | DIP | DFP |
| 封装等效代码 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | NO | YES | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | - |
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