PIR Sensor Light Switch Controller
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 9.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| PT8A2621W | PT8A2611 | PT8A2621DE | PT8A2621P | PT8A2621 | PT8A2611P | PT8A2611W | PT8A2611DE | |
|---|---|---|---|---|---|---|---|---|
| 描述 | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller | PIR Sensor Light Switch Controller |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | - | DIE | DIP | - | DIP | SOIC | DIE |
| 包装说明 | SOP, SOP16,.25 | - | DIE, | DIP, DIP16,.25 | - | DIP, DIP16,.25 | SOP, SOP16,.25 | DIE, |
| 针数 | 16 | - | 18 | 16 | - | 16 | 16 | 18 |
| Reach Compliance Code | compli | - | compli | compli | - | compli | compli | compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | - | ANALOG CIRCUIT | ANALOG CIRCUIT | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 | - | R-XUUC-N18 | R-PDIP-T16 | - | R-PDIP-T16 | R-PDSO-G16 | R-XUUC-N18 |
| JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e0 | e0 |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | - | 18 | 16 | - | 16 | 16 | 18 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -25 °C | - | -25 °C | -25 °C | - | -25 °C | -25 °C | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | SOP | - | DIE | DIP | - | DIP | SOP | DIE |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | UNCASED CHIP | IN-LINE | - | IN-LINE | SMALL OUTLINE | UNCASED CHIP |
| 峰值回流温度（摄氏度） | 235 | - | 235 | 235 | - | 235 | 235 | 235 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 6 V | - | 6 V | 6 V | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 4.75 V | - | 4.75 V | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | NO | - | NO | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | - | OTHER | OTHER | - | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | GULL WING | - | NO LEAD | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | NO LEAD |
| 端子位置 | DUAL | - | UPPER | DUAL | - | DUAL | DUAL | UPPER |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | 20 | - | 20 | 20 | 20 |
| 厂商名称 | - | - | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) | - | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) |
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