buffers & line drivers 6.5 V xson8
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SON |
| 包装说明 | VSON, SOLCC8,.04,14 |
| 针数 | 8 |
| 制造商包装代码 | SOT1203 |
| Reach Compliance Code | compli |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 1.35 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUFFER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装等效代码 | SOLCC8,.04,14 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 7.1 ns |
| 传播延迟（tpd） | 13.1 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | YES |
| 座面最大高度 | 0.35 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.35 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1 mm |
| Base Number Matches | 1 |
| 74LVC3G17GS,115 | 74LVC3G17DP,125 | 74LVC3G17DC,125 | 74LVC3G17GD,125 | 74LVC3G17GN,115 | 74LVC3G17GM,125 | 74LVC3G17GF,115 | |
|---|---|---|---|---|---|---|---|
| 描述 | buffers & line drivers 6.5 V xson8 | buffers & line drivers trip NO-inv sch trig | buffers & line drivers 3.3V 3X NO-inv sch | buffers & line drivers schmitt trig buffer 3-CH non-invert cmos | inverters triple non-inverting schmitt trigger | buffers & line drivers 3.3V tri ninv | inverters triple non-inv schmt trigger W/ 5V input |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SON | TSSOP | SSOP | SON | SON | QFN | SON |
| 包装说明 | VSON, SOLCC8,.04,14 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 | SON, SOLCC8,.04,12 | 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8 | VSON, SOLCC8,.04,14 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | SOT1203 | SOT505-2 | SOT765-1 | SOT996-2 | SOT1116 | SOT902-2 | SOT1089 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PBCC-B8 | R-PDSO-N8 |
| JESD-609代码 | e3 | e4 | e4 | e4 | e3 | e4 | e3 |
| 长度 | 1.35 mm | 3 mm | 2.3 mm | 3 mm | 1.2 mm | 1.95 mm | 1.35 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | TSSOP | VSSOP | VSON | SON | VBCC | VSON |
| 封装等效代码 | SOLCC8,.04,14 | TSSOP8,.16 | TSSOP8,.12,20 | SOLCC8,.11,20 | SOLCC8,.04,12 | LCC8,.06SQ,20 | SOLCC8,.04,14 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 7.1 ns | 7.1 ns | 7.1 ns | 7.1 ns | 7.1 ns | 7.1 ns | 7.1 ns |
| 传播延迟（tpd） | 13.1 ns | 13.1 ns | 13.1 ns | 13.1 ns | 13.1 ns | 13.1 ns | 13.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | YES | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 0.35 mm | 1.1 mm | 1 mm | 0.5 mm | 0.35 mm | 0.5 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 1.8 V | 1.8 V | 1.8 V | 3.3 V | 1.8 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Tin (Sn) | NICKEL PALLADIUM GOLD | Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD | BUTT | NO LEAD |
| 端子节距 | 0.35 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.3 mm | 0.5 mm | 0.35 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED |
| 宽度 | 1 mm | 3 mm | 2 mm | 2 mm | 1 mm | 0.95 mm | 1 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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