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74LVC3G17GM,125: 产品描述buffers & line drivers 3.3V tri ninv; 产品类别逻辑逻辑; 文件大小289KB，共23页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74LVC3G17GM,125概述

buffers & line drivers 3.3V tri ninv

74LVC3G17GM,125规格参数

参数名称	属性值
Brand Name	NXP Semiconduc
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	QFN
包装说明	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
针数	8
制造商包装代码	SOT902-2
Reach Compliance Code	compli
系列	LVC/LCX/Z
JESD-30 代码	R-PBCC-B8
JESD-609代码	e4
长度	1.95 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUFFER
最大I（ol）	0.024 A
湿度敏感等级	1
功能数量	3
输入次数	1
端子数量	8
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	VBCC
封装等效代码	LCC8,.06SQ,20
封装形状	RECTANGULAR
封装形式	CHIP CARRIER, VERY THIN PROFILE
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	3.3 V
Prop。Delay @ Nom-Su	7.1 ns
传播延迟（tpd）	13.1 ns
认证状态	Not Qualified
施密特触发器	YES
座面最大高度	0.5 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.65 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	BUTT
端子节距	0.5 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	0.95 mm
Base Number Matches	1

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74LVC3G17

Triple non-inverting Schmitt trigger with 5 V tolerant input

Rev. 11 — 9 April 2013

Product data sheet

1. General description

The 74LVC3G17 provides three non-inverting buffers with Schmitt trigger input. It is

capable of transforming slowly changing input signals into sharply defined, jitter-free

output signals.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the

74LVC3G17 as a translator in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing a damaging backflow current through the device

when it is powered down.

2. Features and benefits



Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant input/output for interfacing with 5 V logic

High noise immunity

ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V

24

mA output drive (V

= 3.0 V)

CMOS low-power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Multiple package options

Specified from

40 C

to +85

C

and

40 C

to +125

C



3. Applications



Wave and pulse shapers for highly noisy environments

74LVC3G17GM,125相似产品对比

	74LVC3G17GM,125	74LVC3G17DP,125	74LVC3G17DC,125	74LVC3G17GD,125	74LVC3G17GN,115	74LVC3G17GS,115	74LVC3G17GF,115
描述	buffers & line drivers 3.3V tri ninv	buffers & line drivers trip NO-inv sch trig	buffers & line drivers 3.3V 3X NO-inv sch	buffers & line drivers schmitt trig buffer 3-CH non-invert cmos	inverters triple non-inverting schmitt trigger	buffers & line drivers 6.5 V xson8	inverters triple non-inv schmt trigger W/ 5V input
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	QFN	TSSOP	SSOP	SON	SON	SON	SON
包装说明	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8	3 MM, PLASTIC, SOT505-2, TSSOP-8	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8	SON, SOLCC8,.04,12	VSON, SOLCC8,.04,14	VSON, SOLCC8,.04,14
针数	8	8	8	8	8	8	8
制造商包装代码	SOT902-2	SOT505-2	SOT765-1	SOT996-2	SOT1116	SOT1203	SOT1089
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli
系列	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 代码	R-PBCC-B8	S-PDSO-G8	R-PDSO-G8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8
JESD-609代码	e4	e4	e4	e4	e3	e3	e3
长度	1.95 mm	3 mm	2.3 mm	3 mm	1.2 mm	1.35 mm	1.35 mm
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
最大I（ol）	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
湿度敏感等级	1	1	1	1	1	1	1
功能数量	3	3	3	3	3	3	3
输入次数	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VBCC	TSSOP	VSSOP	VSON	SON	VSON	VSON
封装等效代码	LCC8,.06SQ,20	TSSOP8,.16	TSSOP8,.12,20	SOLCC8,.11,20	SOLCC8,.04,12	SOLCC8,.04,14	SOLCC8,.04,14
封装形状	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
包装方法	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
峰值回流温度（摄氏度）	260	260	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Su	7.1 ns	7.1 ns	7.1 ns	7.1 ns	7.1 ns	7.1 ns	7.1 ns
传播延迟（tpd）	13.1 ns	13.1 ns	13.1 ns	13.1 ns	13.1 ns	13.1 ns	13.1 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
施密特触发器	YES	YES	YES	YES	YES	YES	YES
座面最大高度	0.5 mm	1.1 mm	1 mm	0.5 mm	0.35 mm	0.35 mm	0.5 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Tin (Sn)	Tin (Sn)	Tin (Sn)
端子形式	BUTT	GULL WING	GULL WING	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	0.5 mm	0.65 mm	0.5 mm	0.5 mm	0.3 mm	0.35 mm	0.35 mm
端子位置	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	0.95 mm	3 mm	2 mm	2 mm	1 mm	1 mm	1 mm
Base Number Matches	1	1	1	1	1	1	1

74LVC3G17GM,125

74LVC3G17GM,125概述

74LVC3G17GM,125规格参数

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