电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CM105CG181J50AT

产品描述Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小365KB,共20页
制造商Kyocera(京瓷)
标准
相似器件已查找到19个与CM105CG181J50AT功能相似器件
下载文档 详细参数 全文预览

CM105CG181J50AT概述

Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

CM105CG181J50AT规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Kyocera(京瓷)
包装说明, 0603
Reach Compliance Codecompli
ECCN代码EAR99
电容0.00018 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度0.8 mm
JESD-609代码e3
长度1.6 mm
安装特点SURFACE MOUNT
多层Yes
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, PAPER, 7 INCH
正容差5%
额定(直流)电压(URdc)50 V
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数-/+30ppm/Cel ppm/°C
端子面层Tin (Sn) - with Nickel (Ni) barrie
端子形状WRAPAROUND
宽度0.8 mm

文档预览

下载PDF文档
Multilayer Ceramic Chip Capacitors
Kyocera's series of Multilayer Ceramic Chip Capacitors
are designed to meet a wide variety of needs. We offer
a complete range of products for both general and
specialized applications, including CM series for general-
purpose, CT series for low profile, CA series for arrays,
CL series for ICs, CF series for high-voltage, and DM
series for automotive.
Features
• We have factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as one
of the highest−volume producers in the industry.
• All our products are highly reliable due to their monolithic structure
of high−purity and superfine uniform ceramics and their integral
internal electrodes.
• By combining superior manufacturing technology and materials
with high dielectric constants, we produce extremely compact
components with exceptional specifications.
• Our stringent quality control in every phase of production from
material procurement to shipping ensures consistent manufacturing
and super quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to
meet specific configurational requirements.
RoHS Compliant
series
Automotive
DM
series
General
CM
series
High-Voltage
CF
Multilayer
Ceramic Chip
Capacitors
series
ICs
series
Low Profile
CT
CL
series
Arrays
CA
Structure
External Termination
Electrodes
Nickel Barrier Termination Products
Internal Electrodes
(Pd, Pd/ Ag or Ni)
Dielectric Ceramic Layer
Temperature compensation: Titanate family
Zirconate family
High dielectric constant:
Barium Titanate family
Ag or Cu or
CuNi
Ni Plating
Sn or Au Plating
Tape and Reel
Bulk Case
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.

与CM105CG181J50AT功能相似器件

器件名 厂商 描述
0603J0500181JAR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
0603J0500181JAT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
0603J0500181JCR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
0603J0500181JCT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
0603Y0500181JAR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
0603Y0500181JAT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
222286715181 YAGEO(国巨) Ceramic Capacitor, Multilayer, Ceramic, 50V, NP0, -/+30ppm/Cel TC, 0.00018uF, 0603
223886775181 YAGEO(国巨) Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
225486745181 YAGEO(国巨) Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
C0603C181J5GAC KEMET(基美) Multilayer Ceramic Capacitors MLCC - SMD/SMT 50volts 180pF 5% C0G
C0603T181J5GAL KEMET(基美) Multilayer Ceramic Capacitors MLCC - SMD/SMT 180.PF 50.0V
C0603X181J5GAC KEMET(基美) Multilayer Ceramic Capacitors MLCC - SMD/SMT
C0603X181J5GACAUTO KEMET(基美) Multilayer Ceramic Capacitors MLCC - SMD/SMT 50volts 0.1uF 5% C0G AUTO
CC0603JCNPO9BN181 YAGEO(国巨) Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
CGJ3E2C0G1H181J080AA TDK(株式会社) Multilayer Ceramic Capacitors MLCC - SMD/SMT CGJ 0603 50V 180pF C0G 5% T: 0.8mm
CL10C181JB8NNNS SAMSUNG(三星) Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
CM105CG181J50AH Kyocera(京瓷) Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
HH18N181J500CG Walsin_Technology_Corporation Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
HH18N181J500CT Walsin_Technology_Corporation Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0603, CHIP
毕业课题需要申请使用
:):) 希望论坛能给与资助...
qixiaoguang FPGA/CPLD
LM5117效率问题
LM5117做降压型直流稳压电路后接液晶屏效率就被拉低达不到85%,并随负载电阻发热温飘影响到每次的读数,效率值就在75%~85%徘徊了,求提高效率方案啊啊啊{:1_110:}?...
大道东 模拟与混合信号
Release 版 动态加载DLL 失败
代码 1 CString strMoudle; 2 m_ctlDeviceName.GetWindowTextW(strMoudle); 3 strMoudle = GetIniInfo(strMoudle); //根据strMoudle找到其对应的DLL名,就是读配置文件。次函数正常 ......
123liuxiao 嵌入式系统
eZ430-RF2500试用心得(一)
今天成都虽然又是阴天,但是不同于其它季节,这样的天气对春末夏初(其实感觉根本没经过春天就直接进入夏天了),已经高达30多度的炎热正好是一个缓解。我的心情也很好,不仅是因为稍许消散的暑 ......
wwh19910609 微控制器 MCU
电子标签导电胶降低成本的优势
电子标签导电胶降低成本的优势 RFID标签作为一种智能标签,正在被越来越多的使用者和标签制造者所重视,但这类标签不同于其他标签产品,可完全由印刷来完成,要利用印刷技术完成RFID标签的印制 ......
ufuture 能源基础设施
5G毫米波终端技术及测试方案分析
1、引言  随着移动通信的迅猛发展,低频段频谱资源的开发已经非常成熟,剩余的低频段频谱资源已经不能满足时代10Gbps的峰值速率需求,因此未来5G系统需要在频段上寻找可用的频谱资源。作为5G ......
Jacktang 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2900  1873  1689  1485  1313  16  49  38  15  27 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved