digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
零件包装代码 | DIP |
包装说明 | 0.300 INCH, LEAD FREE, PLASTIC, SDIP-28 |
针数 | 28 |
Reach Compliance Code | compli |
ECCN代码 | 3A991.A.2 |
Factory Lead Time | 4 weeks |
具有ADC | YES |
地址总线宽度 | |
位大小 | 16 |
最大时钟频率 | 32 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | 16 |
格式 | FIXED POINT |
JESD-30 代码 | R-PDIP-T28 |
JESD-609代码 | e3 |
长度 | 34.671 mm |
I/O 线路数量 | 21 |
端子数量 | 28 |
片上程序ROM宽度 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP28,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT APPLICABLE |
电源 | 3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 1024 |
RAM(字数) | 1024 |
ROM(单词) | 5461 |
ROM可编程性 | FLASH |
座面最大高度 | 5.08 mm |
速度 | 16 MHz |
最大压摆率 | 21 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT APPLICABLE |
宽度 | 7.62 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
DSPIC33FJ16GP102-I/SP | DSPIC33FJ16GP102-E/ML | DSPIC33FJ16GP101-E/P | DSPIC33FJ16GP101-I/SS | DSPIC33FJ16GP102-E/SS | DSPIC33FJ16GP101-E/SS | DSPIC33FJ16GP102T-I/SO | DSPIC33FJ16GP102-I/SS | DSPIC33FJ16GP102-I/ML | |
---|---|---|---|---|---|---|---|---|---|
描述 | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram | digital signal processors & controllers - dsp, dsc 16bit dsc fam 16mips 16kb FL 1kb ram |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
零件包装代码 | DIP | QFN | DIP | SSOP | SSOP | SSOP | SOIC | SSOP | QFN |
包装说明 | 0.300 INCH, LEAD FREE, PLASTIC, SDIP-28 | 6 X 6 MM, LEAD FREE, PLASTIC, QFN-28 | 0.300 INCH, LEAD FREE, PLASTIC, DIP-18 | 5.30 MM, LEAD FREE, PLASTIC, SSOP-20 | 5.30 MM, LEAD FREE, PLASTIC, SSOP-28 | 5.30 MM, LEAD FREE, PLASTIC, SSOP-20 | 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 | 5.30 MM, LEAD FREE, PLASTIC, SSOP-28 | HVQCCN, LCC28,.24SQ,25 |
针数 | 28 | 28 | 18 | 20 | 28 | 20 | 28 | 28 | 28 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compliant | compliant |
ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES | YES |
位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最大时钟频率 | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
JESD-30 代码 | R-PDIP-T28 | S-PQCC-N28 | R-PDIP-T18 | R-PDSO-G20 | R-PDSO-G28 | R-PDSO-G20 | R-PDSO-G28 | R-PDSO-G28 | S-PQCC-N28 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 34.671 mm | 6 mm | 22.86 mm | 7.2 mm | 10.2 mm | 7.2 mm | 17.9 mm | 10.2 mm | 6 mm |
I/O 线路数量 | 21 | 21 | 13 | 13 | 21 | 13 | 21 | 21 | 21 |
端子数量 | 28 | 28 | 18 | 20 | 28 | 20 | 28 | 28 | 28 |
片上程序ROM宽度 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | HVQCCN | DIP | SSOP | SSOP | SSOP | SOP | SSOP | HVQCCN |
封装等效代码 | DIP28,.3 | LCC28,.24SQ,25 | DIP18,.3 | SSOP20,.3 | SSOP28,.3 | SSOP20,.3 | SOP28,.4 | SSOP28,.3 | LCC28,.24SQ,25 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT APPLICABLE | 260 | NOT SPECIFIED | 260 | 260 | 260 | 250 | 260 | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
RAM(字数) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
ROM(单词) | 5461 | 5461 | 5461 | 5461 | 5461 | 5461 | 5461 | 5461 | 5461 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 5.08 mm | 1 mm | 5.334 mm | 2 mm | 2 mm | 2 mm | 2.65 mm | 2 mm | 1 mm |
速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
最大压摆率 | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | YES | NO | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
端子节距 | 2.54 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT APPLICABLE | 40 | NOT SPECIFIED | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | 7.62 mm | 6 mm | 7.62 mm | 5.3 mm | 5.3 mm | 5.3 mm | 7.5 mm | 5.3 mm | 6 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Factory Lead Time | 4 weeks | 19 weeks | - | 5 weeks | - | 5 weeks | 4 weeks | 16 weeks | 7 weeks |
湿度敏感等级 | - | 1 | - | 2 | 1 | 2 | 1 | 2 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved