C6000 DSP+ARM Processor 361-NFBGA -40 to 105
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, |
| 针数 | 361 |
| Reach Compliance Code | compli |
| Factory Lead Time | 6 weeks |
| 其他特性 | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
| JESD-30 代码 | S-PBGA-B361 |
| JESD-609代码 | e1 |
| 长度 | 16 mm |
| 湿度敏感等级 | 3 |
| 端子数量 | 361 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 | 1.32 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| OMAPL132EZWTA2E | OMAPL132EZWT2 | OMAPL132EZWTA2 | OMAPL132EZWTA2R | |
|---|---|---|---|---|
| 描述 | C6000 DSP+ARM Processor 361-NFBGA -40 to 105 | C6000 DSP+ARM Processor 361-NFBGA 0 to 90 | C6000 DSP+ARM Processor 361-NFBGA -40 to 105 | C6000 DSP+ARM Processor 361-NFBGA -40 to 105 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, | LFBGA, | LFBGA, | LFBGA, |
| 针数 | 361 | 361 | 361 | 361 |
| Reach Compliance Code | compli | compli | compli | compli |
| Factory Lead Time | 6 weeks | 6 weeks | 1 week | 12 weeks |
| 其他特性 | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
| JESD-30 代码 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 |
| JESD-609代码 | e1 | e1 | e1 | e1 |
| 长度 | 16 mm | 16 mm | 16 mm | 16 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 端子数量 | 361 | 361 | 361 | 361 |
| 最高工作温度 | 105 °C | 90 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
| 最小供电电压 | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | OTHER | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 16 mm | 16 mm | 16 mm | 16 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
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