ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63
ATM/SONET/SDH辅助电路, PBGA63
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 63 |
| 最大工作温度 | 85 Cel |
| 最小工作温度 | -20 Cel |
| 额定供电电压 | 3.3 V |
| 加工封装描述 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 |
| 状态 | ACTIVE |
| 包装形状 | SQUARE |
| 包装尺寸 | GRID ARRAY, LOW PROFILE |
| 表面贴装 | Yes |
| 端子形式 | BALL |
| 端子间距 | 1 mm |
| 端子位置 | BOTTOM |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | OTHER |
| 同步数字系列应用 | SDH Application |
| sonnet应用 | SONET Application |
| 通信类型 | SUPPORT CIRCUIT |
| SI5321-H-BL | SI5321 | SI5321-G-BC | SI5321-H-GL | |
|---|---|---|---|---|
| 描述 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 63 | 63 | 63 | 63 |
| 最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
| 最小工作温度 | -20 Cel | -20 Cel | -20 Cel | -20 Cel |
| 额定供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 加工封装描述 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 |
| 状态 | ACTIVE | ACTIVE | ACTIVE | Active |
| 包装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 包装尺寸 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 表面贴装 | Yes | Yes | Yes | YES |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子间距 | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 温度等级 | OTHER | OTHER | OTHER | OTHER |
| 通信类型 | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
| 同步数字系列应用 | SDH Application | SDH Application | SDH Application | - |
| sonnet应用 | SONET Application | SONET Application | SONET Application | - |
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