ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63
ATM/SONET/SDH辅助电路, PBGA63
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 63 |
最小工作温度 | -20 Cel |
最大工作温度 | 85 Cel |
加工封装描述 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 |
状态 | Active |
通信类型 | ATM/SONET/SDH SUPPORT CIRCUIT |
lication_s_ | SONET;SDH |
jesd_30_code | S-PBGA-B63 |
包装材料 | PLASTIC/EPOXY |
ckage_code | LBGA |
包装形状 | SQUARE |
包装尺寸 | GRID ARRAY, LOW PROFILE |
qualification_status | COMMERCIAL |
seated_height_max | 1.58 mm |
额定供电电压 | 3.3 V |
表面贴装 | YES |
温度等级 | OTHER |
端子形式 | BALL |
端子间距 | 1 mm |
端子位置 | BOTTOM |
length | 9 mm |
width | 9 mm |
SI5321-H-GL | SI5321 | SI5321-G-BC | SI5321-H-BL | |
---|---|---|---|---|
描述 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 63 | 63 | 63 | 63 |
最小工作温度 | -20 Cel | -20 Cel | -20 Cel | -20 Cel |
最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
加工封装描述 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 |
状态 | Active | ACTIVE | ACTIVE | ACTIVE |
通信类型 | ATM/SONET/SDH SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT |
包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
包装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
包装尺寸 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
额定供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | Yes | Yes | Yes |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子形式 | BALL | BALL | BALL | BALL |
端子间距 | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
同步数字系列应用 | - | SDH Application | SDH Application | SDH Application |
sonnet应用 | - | SONET Application | SONET Application | SONET Application |
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