Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB60R385CP
MA000737376
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
5.064
0.304
0.091
304.026
0.756
10.302
113.324
563.186
9.657
0.228
0.001
0.100
0.080
3.836
0.165
0.548
547.666
Average
Mass
[%]
0.32
0.02
0.01
19.50
0.05
0.66
7.27
36.10
0.62
0.01
0.00
0.01
0.01
0.25
0.01
0.04
35.12
29. August 2013
1559.34 mg
Sum
[%]
0.32
Average
Mass
[ppm]
3248
195
59
19.53
0.05
194971
485
6607
72674
44.03
0.62
361170
6193
147
0.01
1
64
52
0.27
2460
105
352
35.17
351217
351674
1000000
2576
147
440452
6193
195225
485
Sum
[ppm]
3248
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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