Digital Bus Switch ICs Sngl FET Bus Switch w/Level Shifting
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP5/6,.08 |
| 针数 | 5 |
| Reach Compliance Code | compliant |
| Base Number Matches | 1 |
| 74CBTD1G125DCKTE4 | 74CBTD1G125DBVRE4 | 74CBTD1G125DBVRG4 | 74CBTD1G125DBVTE4 | 74CBTD1G125DBVTG4 | 74CBTD1G125DCKRE4 | 74CBTD1G125DCKTG4 | |
|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs Sngl FET Bus Switch w/Level Shifting | Digital Bus Switch ICs Sngl FET Bus Switch w/Level Shifting | Digital Bus Switch ICs Single FET Bus Sw | Digital Bus Switch ICs Sngl FET Bus Switch w/Level Shifting | Digital Bus Switch ICs Single FET Bus Sw | Digital Bus Switch ICs Sngl FET Bus Switch w/Level Shifting | Digital Bus Switch ICs Single FET Bus Sw |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOIC | SOIC |
| 包装说明 | TSSOP, TSSOP5/6,.08 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | TSSOP, TSSOP5/6,.08 | TSSOP, TSSOP5/6,.08 |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | compliant | compli | compliant | compliant | compliant | compliant | compliant |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 系列 | - | CBT/FST/QS/5C/B | - | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - | CBT/FST/QS/5C/B |
| JESD-30 代码 | - | R-PDSO-G5 | - | R-PDSO-G5 | R-PDSO-G5 | - | R-PDSO-G5 |
| JESD-609代码 | - | e4 | - | e4 | e4 | - | e4 |
| 长度 | - | 2.9 mm | - | 2.9 mm | 2.9 mm | - | 2 mm |
| 逻辑集成电路类型 | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
| 湿度敏感等级 | - | 1 | - | 1 | 1 | - | 1 |
| 位数 | - | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | - | 1 | - | 1 | 1 | - | 1 |
| 端口数量 | - | 2 | - | 2 | 2 | - | 2 |
| 端子数量 | - | 5 | - | 5 | 5 | - | 5 |
| 最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| 输出特性 | - | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE |
| 输出极性 | - | TRUE | - | TRUE | TRUE | - | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | LSSOP | - | LSSOP | LSSOP | - | TSSOP |
| 封装等效代码 | - | TSOP5/6,.11,37 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | - | TSSOP5/6,.08 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 260 | - | 260 | 260 | - | 260 |
| 电源 | - | 5 V | - | 5 V | 5 V | - | 5 V |
| 传播延迟（tpd） | - | 0.25 ns | - | 0.25 ns | 0.25 ns | - | 0.25 ns |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 1.45 mm | - | 1.45 mm | 1.45 mm | - | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | - | 5 V | 5 V | - | 5 V |
| 表面贴装 | - | YES | - | YES | YES | - | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | - | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | - | 0.95 mm | - | 0.95 mm | 0.95 mm | - | 0.65 mm |
| 端子位置 | - | DUAL | - | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | - | 1.6 mm | - | 1.6 mm | 1.6 mm | - | 1.25 mm |
DSP 与 ARM 处理器
求职招聘
WindowsCE
电源技术
RF/无线
电源技术
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
