Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SON |
包装说明 | HVSON, |
针数 | 8 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-N8 |
JESD-609代码 | e4 |
长度 | 3 mm |
湿度敏感等级 | 1 |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
TPS2066ADRBRG4 | TPS2062ADRBRG4 | TPS2066ADG4 | TPS2066ADRBTG4 | TPS2066ADRG4 | TPS2062ADRG4 | |
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描述 | Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw | Power Switch ICs - Power Distribution Crnt-Ltd Pwr Dist Sw | Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw | Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw | Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw | Power Switch ICs - Power Distribution Crnt-Ltd Pwr Dist Sw |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | SON | SON | SOIC | SON | SOIC | SOIC |
包装说明 | HVSON, | HVSON, | SOP, | GREEN, PLASTIC, SON-8 | SOP, | SON, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
可调阈值 | NO | NO | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-N8 | S-PDSO-N8 | R-PDSO-G8 | S-PDSO-N8 | R-PDSO-G8 | S-PDSO-N8 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 3 mm | 3 mm | 4.9 mm | 3 mm | 4.9 mm | 4.9 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 2 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | HVSON | SOP | HVSON | SOP | SON |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1.75 mm | 1 mm | 1.75 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 3.9 mm | 3 mm | 3.9 mm | 3.9 mm |
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