Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4251G
MA000714752
PG-TO263-5-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
2.717
0.483
0.145
482.096
0.287
1.457
67.035
660.146
12.370
0.243
0.001
0.103
0.082
3.921
0.133
0.442
441.456
Average
Mass
[%]
0.16
0.03
0.01
28.81
0.02
0.09
4.01
39.45
0.74
0.01
0.00
0.01
0.00
0.23
0.01
0.03
26.39
28. August 2013
1673.12 mg
Sum
[%]
0.16
Average
Mass
[ppm]
1624
289
87
28.85
0.02
288143
171
871
40066
43.55
0.74
394561
7393
145
0.01
0
61
49
0.24
2344
79
264
26.43
263853
264196
1000000
2454
145
435498
7393
288519
171
Sum
[ppm]
1624
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com