电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CAT25128YE.GT3

产品描述128-Kb SPI Serial CMOS EEPROM
文件大小217KB,共20页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 全文预览

CAT25128YE.GT3概述

128-Kb SPI Serial CMOS EEPROM

文档预览

下载PDF文档
CAT25128
128-Kb SPI Serial CMOS
EEPROM
Description
The CAT25128 is a 128−Kb Serial CMOS EEPROM device
internally organized as 16Kx8 bits. This features a 64−byte page write
buffer and supports the Serial Peripheral Interface (SPI) protocol. The
device is enabled through a Chip Select (CS) input. In addition, the
required bus signals are clock input (SCK), data input (SI) and data
output (SO) lines. The HOLD input may be used to pause any serial
communication with the CAT25128 device. The device features
software and hardware write protection, including partial as well as
full array protection.
On−Chip ECC (Error Correction Code) makes the device suitable
for high reliability applications.*
Features
http://onsemi.com
SOIC−8
V SUFFIX
CASE 751BD
TDFN−8**
VP2 SUFFIX
CASE 511AK
UDFN−8
HU4 SUFFIX
CASE 517AZ
20 MHz SPI Compatible
1.8 V to 5.5 V Supply Voltage Range
SPI Modes (0,0) & (1,1)
64−byte Page Write Buffer
Additional Identification Page with Permanent Write Protection
Self−timed Write Cycle
Hardware and Software Protection
Block Write Protection
Protect 1/4, 1/2 or Entire EEPROM Array
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
8−lead PDIP, SOIC, TSSOP and 8−pad TDFN, UDFN Packages
This Device is Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
V
CC
PDIP−8
L SUFFIX
CASE 646AA
TSSOP−8
Y SUFFIX
CASE 948AL
SOIC−8
X SUFFIX
CASE 751BE
PIN CONFIGURATION
CS
SO
WP
V
SS
1
V
CC
HOLD
SCK
SI
PDIP (L), SOIC (X, V),
TSSOP (Y), TDFN** (VP2), UDFN (HU4)
** The TDFN−8 (VP2) package is not recommended
for new designs.
PIN FUNCTION
Pin Name
CS
SO
Function
Chip Select
Serial Data Output
Write Protect
Ground
Serial Data Input
Serial Clock
Hold Transmission Input
Power Supply
SI
CS
WP
HOLD
SCK
V
SS
CAT25128
SO
WP
V
SS
SI
SCK
HOLD
V
CC
Figure 1. Functional Symbol
†The exposed pad for the TDFN/UDFN packages can
be left floating or connected to Ground.
* Available for New Product (Rev. E)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 19 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
September, 2012
Rev. 7
1
Publication Order Number:
CAT25128/D

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 215  1733  2706  292  746  48  14  15  38  55 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved