Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA1031,37X37,25 |
| 针数 | 1031 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| 地址总线宽度 | 16 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 27 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B1031 |
| JESD-609代码 | e1 |
| 长度 | 25 mm |
| 低功率模式 | NO |
| 湿度敏感等级 | 4 |
| 端子数量 | 1031 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA1031,37X37,25 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 16384 |
| 座面最大高度 | 3.31 mm |
| 最大供电电压 | 1.05 V |
| 最小供电电压 | 0.95 V |
| 标称供电电压 | 1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 25 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS320DM8168ACYG2 | TMS320DM8165SCYG2 | TMS320DM8167SCYG | TMS320DM8167SCYG4 | TMS320DM8168BCYG2 | TMS320DM8168BCYGA2 | TMS320DM8168SCYG | TMS320DM8168SCYG2 | TMS320DM8168SCYG4 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc | DaVinci Digital Media Processor 1031-FCBGA 0 to 95 | DaVinci Digital Media Processor 1031-FCBGA 0 to 95 | DaVinci Digital Media Processor 1031-FCBGA 0 to 95 | Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc | Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc | DaVinci Digital Media Processor 1031-FCBGA 0 to 95 | DaVinci Digital Media Processor 1031-FCBGA 0 to 95 | DaVinci Digital Media Processor 1031-FCBGA 0 to 95 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, BGA1031,37X37,25 | HBGA, BGA1031,37X37,25 | HBGA, BGA1031,37X37,25 | HBGA, BGA1031,37X37,25 | FBGA, BGA1031,37X37,25 | FBGA, BGA1031,37X37,25 | HBGA, BGA1031,37X37,25 | HBGA, BGA1031,37X37,25 | HBGA, BGA1031,37X37,25 |
| 针数 | 1031 | 1031 | 1031 | 1031 | 1031 | 1031 | 1031 | 1031 | 1031 |
| Reach Compliance Code | compli | compli | compli | compli | compli | unknow | compli | compliant | compli |
| 地址总线宽度 | 16 | 15 | 15 | 15 | 28 | 28 | 15 | - | 15 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO | - | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | - | YES |
| 外部数据总线宽度 | 16 | 32 | 32 | 32 | 16 | 16 | 32 | - | 32 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | - | FLOATING POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | - | MULTIPLE |
| JESD-30 代码 | S-PBGA-B1031 | S-PBGA-B1031 | S-PBGA-B1031 | S-PBGA-B1031 | S-PBGA-B1031 | S-PBGA-B1031 | S-PBGA-B1031 | - | S-PBGA-B1031 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | - | e1 |
| 长度 | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | - | 25 mm |
| 低功率模式 | NO | YES | YES | YES | YES | YES | YES | - | YES |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - | 4 |
| 端子数量 | 1031 | 1031 | 1031 | 1031 | 1031 | 1031 | 1031 | - | 1031 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | FBGA | HBGA | HBGA | HBGA | FBGA | FBGA | HBGA | - | HBGA |
| 封装等效代码 | BGA1031,37X37,25 | BGA1031,37X37,25 | BGA1031,37X37,25 | BGA1031,37X37,25 | BGA1031,37X37,25 | BGA1031,37X37,25 | BGA1031,37X37,25 | - | BGA1031,37X37,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG | - | GRID ARRAY, HEAT SINK/SLUG |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | 245 | 245 | 245 | - | 245 |
| 电源 | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | - | 1 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| RAM（字数） | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | - | 16384 |
| 座面最大高度 | 3.31 mm | 3.31 mm | 3.31 mm | 3.31 mm | 3.31 mm | 3.31 mm | 3.31 mm | - | 3.31 mm |
| 最大供电电压 | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | - | 1.05 V |
| 最小供电电压 | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | - | 0.95 V |
| 标称供电电压 | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | - | 1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | - | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | - | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | - | 25 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | - | DIGITAL SIGNAL PROCESSOR, MIXED |
| 集成缓存 | - | YES | YES | YES | - | - | YES | - | YES |
| DMA 通道数量 | - | 72 | 72 | 72 | - | - | 72 | - | 72 |
| 计时器数量 | - | 8 | 8 | 8 | - | - | 8 | - | 8 |
| 最高工作温度 | - | 95 °C | 95 °C | 95 °C | - | - | 95 °C | - | 95 °C |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | OTHER | - | OTHER |
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