SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | 3A991b.1.a. |
| Part Status | Unconfirmed |
| HTS | 8542.32.00.71 |
| Cell Type | SLC NAND |
| Chip Density (bit) | 2G |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Address Bus Width (bit) | 29 |
| Sector Size | 128Kbyte x 2048 |
| Page Size | 2Kbyte |
| Number of Bits/Word (bit) | 8 |
| Number of Words | 256M |
| Programmability | Yes |
| Timing Type | Asynchronous |
| Maximum Erase Time (S) | 0.003/Block |
| Maximum Programming Time (ms) | 0.6/Page |
| 接口类型 Interface Type | Parallel |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Operating Current (mA) | 35 |
| Program Current (mA) | 35 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Command Compatible | No |
| ECC Support | Yes |
| Support of Page Mode | Yes |
| Minimum Endurance (Cycles) | 100000 |
| 系列 Packaging | Tape and Reel |
| Supplier Package | TSOP-I |
| Pin Count | 48 |
| Standard Package Name | SOP |
| Mounting | Surface Mount |
| Package Height | 1(Max) |
| Package Length | 12 |
| Package Width | 18.4 |
| PCB changed | 48 |
| Lead Shape | Gull-wing |
| MT29F2G08ABAEAWP:E TR | MT29F2G08ABAEAH4-ITX:E TR | MT29F2G08ABAEAWPITX:E | MT29F4G08ABAEAWP | MT29F4G08ABAEAWP:E TR | MT29F4G08ABAEAWP:E | |
|---|---|---|---|---|---|---|
| 描述 | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I T/R | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 63-Pin VFBGA | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I | SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP | SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP | SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP |
| 欧盟限制某些有害物质的使用 | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| ECCN (US) | 3A991b.1.a. | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991b.1.a. |
| Part Status | Unconfirmed | NRND | Active | Active | NRND | Active |
| HTS | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 |
| Cell Type | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND |
| Chip Density (bit) | 2G | 2G | 2G | 4G | 4G | 4G |
| Boot Block | Yes | Yes | Yes | No | No | No |
| Number of Bits/Word (bit) | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of Words | 256M | 256M | 256M | 512M | 512M | 512M |
| Programmability | Yes | Yes | Yes | Yes | Yes | Yes |
| Timing Type | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous |
| 接口类型 Interface Type |
Parallel | Parallel | Parallel | Parallel | Parallel | Parallel |
| Minimum Operating Supply Voltage (V) | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 |
| Maximum Operating Temperature (°C) | 70 | 85 | 85 | 70 | 70 | 70 |
| Supplier Temperature Grade | Commercial | Industrial | Industrial | Commercial | Commercial | Commercial |
| Command Compatible | No | No | No | No | No | No |
| ECC Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Support of Page Mode | Yes | Yes | Yes | No | No | No |
| Supplier Package | TSOP-I | VFBGA | TSOP-I | TSOP | TSOP | TSOP |
| Pin Count | 48 | 63 | 48 | 48 | 48 | 48 |
| Standard Package Name | SOP | BGA | SOP | SOP | SOP | SOP |
| Mounting | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package Height | 1(Max) | 1(Max) - 0.25(Min) | 1(Max) | 1(Max) | 1(Max) | 1(Max) |
| Package Length | 12 | 11 | 12 | 12 | 12 | 12 |
| Package Width | 18.4 | 9 | 18.4 | 18.4 | 18.4 | 18.4 |
| PCB changed | 48 | 63 | 48 | 48 | 48 | 48 |
| Lead Shape | Gull-wing | Ball | Gull-wing | Gull-wing | Gull-wing | Gull-wing |
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