SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | 3A991.b.1.a |
Part Status | NRND |
HTS | 8542.32.00.71 |
Cell Type | SLC NAND |
Chip Density (bit) | 4G |
Boot Block | No |
Number of Bits/Word (bit) | 8 |
Number of Words | 512M |
Programmability | Yes |
Timing Type | Asynchronous |
接口类型 Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Temperature Grade | Commercial |
Command Compatible | No |
ECC Support | Yes |
Support of Page Mode | No |
Supplier Package | TSOP |
Pin Count | 48 |
Standard Package Name | SOP |
Mounting | Surface Mount |
Package Height | 1(Max) |
Package Length | 12 |
Package Width | 18.4 |
PCB changed | 48 |
Lead Shape | Gull-wing |
MT29F4G08ABAEAWP:E TR | MT29F2G08ABAEAH4-ITX:E TR | MT29F2G08ABAEAWP:E TR | MT29F2G08ABAEAWPITX:E | MT29F4G08ABAEAWP | MT29F4G08ABAEAWP:E | |
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描述 | SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 63-Pin VFBGA | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I T/R | SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I | SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP | SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP |
欧盟限制某些有害物质的使用 | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
ECCN (US) | 3A991.b.1.a | 3A991.b.1.a | 3A991b.1.a. | 3A991.b.1.a | 3A991.b.1.a | 3A991b.1.a. |
Part Status | NRND | NRND | Unconfirmed | Active | Active | Active |
HTS | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 |
Cell Type | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND |
Chip Density (bit) | 4G | 2G | 2G | 2G | 4G | 4G |
Boot Block | No | Yes | Yes | Yes | No | No |
Number of Bits/Word (bit) | 8 | 8 | 8 | 8 | 8 | 8 |
Number of Words | 512M | 256M | 256M | 256M | 512M | 512M |
Programmability | Yes | Yes | Yes | Yes | Yes | Yes |
Timing Type | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous |
接口类型 Interface Type |
Parallel | Parallel | Parallel | Parallel | Parallel | Parallel |
Minimum Operating Supply Voltage (V) | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 |
Typical Operating Supply Voltage (V) | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 |
Maximum Operating Temperature (°C) | 70 | 85 | 70 | 85 | 70 | 70 |
Supplier Temperature Grade | Commercial | Industrial | Commercial | Industrial | Commercial | Commercial |
Command Compatible | No | No | No | No | No | No |
ECC Support | Yes | Yes | Yes | Yes | Yes | Yes |
Support of Page Mode | No | Yes | Yes | Yes | No | No |
Supplier Package | TSOP | VFBGA | TSOP-I | TSOP-I | TSOP | TSOP |
Pin Count | 48 | 63 | 48 | 48 | 48 | 48 |
Standard Package Name | SOP | BGA | SOP | SOP | SOP | SOP |
Mounting | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Package Height | 1(Max) | 1(Max) - 0.25(Min) | 1(Max) | 1(Max) | 1(Max) | 1(Max) |
Package Length | 12 | 11 | 12 | 12 | 12 | 12 |
Package Width | 18.4 | 9 | 18.4 | 18.4 | 18.4 | 18.4 |
PCB changed | 48 | 63 | 48 | 48 | 48 | 48 |
Lead Shape | Gull-wing | Ball | Gull-wing | Gull-wing | Gull-wing | Gull-wing |
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