NSC858 Universal Asynchronous Receiver/Transmitter
| NSC858 | NSC858E/A+ | NSC858N | NSC858N/A+ | NSC858V | NSC858V/A+ | NSC858E | NSC858D/A+ | NSC858D | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter | NSC858 Universal Asynchronous Receiver/Transmitter |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | - | QCCN, LCC44,.65SQ | - | DIP, DIP28,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCN, LCC44,.65SQ | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | - | unknow | compli | unknow | unknow | unknow | unknow | unknow | unknow |
| Is Samacsys | - | N | N | N | N | N | N | N | N |
| JESD-30 代码 | - | S-PQCC-N44 | R-PDIP-T28 | R-PDIP-T28 | S-PQCC-J44 | S-PQCC-J44 | S-XQCC-N44 | R-CDIP-T28 | R-XDIP-T28 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | - | 44 | 28 | 28 | 44 | 44 | 44 | 28 | 28 |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| 封装代码 | - | QCCN | DIP | DIP | QCCJ | QCCJ | QCCN | DIP | DIP |
| 封装等效代码 | - | LCC44,.65SQ | DIP28,.6 | DIP28,.6 | LDCC44,.7SQ | LDCC44,.7SQ | LCC44,.65SQ | DIP28,.6 | DIP28,.6 |
| 封装形状 | - | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | - | YES | NO | NO | YES | YES | YES | NO | NO |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL |
| uPs/uCs/外围集成电路类型 | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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