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89H24NT6AG2ZCHLG

产品描述FCBGA-484, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小516KB,共35页
制造商IDT (Integrated Device Technology)
标准  
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89H24NT6AG2ZCHLG概述

FCBGA-484, Tray

89H24NT6AG2ZCHLG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明23 X 23 MM, 1 MM PITCH, GREEN, FCBGA-484
针数484
制造商包装代码HLG484
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionFLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Samacsys ManufacturerIDT
其他特性ALSO OPERATES AT 100 MHZ
总线兼容性I2C; ISA; VGA
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码S-PBGA-B484
JESD-609代码e1
长度23 mm
湿度敏感等级4
端子数量484
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)250
电源1,3.3 V
认证状态Not Qualified
座面最大高度2.92 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度23 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

文档解析

集成直接内存访问(DMA)控制器是 89HPES24NT6AG2 的关键优势,支持最多 2 个 DMA 上游端口,每个端口具备 2 个通道,实现高效的 32 位和 64 位内存传输。作为一款 24 通道、6 端口的 PCI Express Gen2 开关,它采用飞越式地址转换减少延迟,提升性能,并支持分区内和跨分区数据传输。服务质量(QoS)机制包括轮询端口仲裁和专有请求计量,平衡带宽分配以最大化系统吞吐量。 在架构细节上,设备采用组合输入输出队列(CIOQ)设计,配备大容量缓冲器,优化流量处理。SerDes 支持 Gen2(5.0 GT/s)和 Gen1(2.5 GT/s)操作,每通道可配置参数如去加重和接收均衡。热插拔功能通过通用事件输出(GPE)引脚通知事件,并支持传统操作系统。此外,设备提供 9 个通用 I/O(GPIO)引脚,可配置为输入、输出或替代功能,增强系统灵活性。 该开关适用于需要高效数据处理的场景,如存储控制器和网络设备,其中 DMA 卸载处理器负载,QoS 保证关键流量优先级。可靠性特性如 ECRC 和 AER 错误报告,结合端到端奇偶校验,提升数据完整性。封装尺寸为 23mm x 23mm BGA,时钟模式支持本地端口时钟与扩频设置,简化系统集成。

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24-Lane 6-Port PCIe® Gen2
System Interconnect Switch
®
89HPES24NT6AG2
Datasheet
Device Overview
The 89HPES24NT6AG2 is a member of the IDT family of PCI
Express® switching solutions. The PES24NT6AG2 is a 24-lane, 6-port
system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include multi-host or
intelligent I/O based systems where inter-domain communication is
required, such as servers, storage, communications, and embedded
systems.
Features
High Performance Non-Blocking Switch Architecture
24-lane, 6-port PCIe switch with flexible port configuration
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 24 GBps (192 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Port Configurability
Six x4 ports
Automatic per port link width negotiation
(x4
x2
x1)
Crosslink support
Automatic lane reversal
Per lane SerDes configuration
De-emphasis
Receive equalization
Drive strength
Innovative Switch Partitioning Feature
Supports up to 6 fully independent switch partitions
Logically independent switches in the same device
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
Dynamic port reconfiguration — downstream, upstream,
non-transparent bridge
Dynamic migration of ports between partitions
Movable upstream port within and between switch partitions
Non-Transparent Bridging (NTB) Support
Supports up to 6 NT endpoints per switch, each endpoint can
communicate with other switch partitions or external PCIe
domains or CPUs
6 BARs per NT Endpoint
Bar address translation
All BARs support 32/64-bit base and limit address translation
Two BARs (BAR2 and BAR4) support look-up table based
address translation
32 inbound and outbound doorbell registers
4 inbound and outbound message registers
Supports up to 64 masters
Unlimited number of outstanding transactions
Multicast
Compliant with the PCI-SIG multicast
Supports 64 multicast groups
Supports multicast across non-transparent port
Multicast overlay mechanism support
ECRC regeneration support
Integrated Direct Memory Access (DMA) Controllers
Supports up to 2 DMA upstream ports, each with 2 DMA chan-
nels
Supports 32-bit and 64-bit memory-to-memory transfers
Fly-by translation provides reduced latency and increased
performance over buffered approach
Supports arbitrary source and destination address alignment
Supports intra- as well as inter-partition data transfers using
the non-transparent endpoint
Supports DMA transfers to multicast groups
Linked list descriptor-based operation
Flexible addressing modes
Linear addressing
Constant addressing
Quality of Service (QoS)
Port arbitration
Round robin
Request metering
IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible port clocking modes
Common clock
Non-common clock
Local port clock with SSC (spread spectrum setting) and port
reference clock input
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 34
2013 Integrated Device Technology, Inc
December 17, 2013

89H24NT6AG2ZCHLG相似产品对比

89H24NT6AG2ZCHLG 89H24NT6AG2ZCHLGI 89H24NT6AG2ZCHLG8 89H24NT6AG2ZBHL 89H24NT6AG2ZBHLG 89H24NT6AG2ZBHLGI8 89H24NT6AG2ZBHLI 89H24NT6AG2ZCHL
描述 FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 不含铅 含铅 不含铅 不含铅 含铅 含铅
是否Rohs认证 符合 符合 符合 不符合 符合 符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
针数 484 484 484 484 484 484 484 484
制造商包装代码 HLG484 HLG484 HLG484 HL484 HLG484 HLG484 HL484 HL484
Reach Compliance Code compliant compliant compliant not_compliant compliant compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 3A001.A.3 EAR99 EAR99 3A001.A.3 3A001.A.3
JESD-609代码 e1 e1 e1 e0 e1 e1 e0 e0
湿度敏感等级 4 4 4 4 4 4 4 4
峰值回流温度(摄氏度) 250 250 250 225 250 250 225 225
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
包装说明 23 X 23 MM, 1 MM PITCH, GREEN, FCBGA-484 BGA, BGA484,22X22,40 - FCBGA-484 BGA, BGA484,22X22,40 , FCBGA-484 23 X 23 MM, 1 MM PITCH, FCBGA-484
Samacsys Description FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - -
其他特性 ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ
总线兼容性 I2C; ISA; VGA I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA
最大时钟频率 125 MHz 125 MHz - 125 MHz 125 MHz - 125 MHz 125 MHz
驱动器接口标准 IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 - S-PBGA-B484 S-PBGA-B484
长度 23 mm 23 mm - 23 mm 23 mm - 23 mm 23 mm
端子数量 484 484 484 484 484 - 484 484
最高工作温度 70 °C 85 °C 70 °C 70 °C 70 °C - 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA - BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 - BGA484,22X22,40 BGA484,22X22,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE - SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V - 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 2.92 mm 2.92 mm - 2.92 mm 2.92 mm - 2.92 mm 2.92 mm
最大供电电压 1.1 V 1.1 V - 1.1 V 1.1 V - 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V - 0.9 V 0.9 V - 0.9 V 0.9 V
标称供电电压 1 V 1 V - 1 V 1 V - 1 V 1 V
表面贴装 YES YES YES YES YES - YES YES
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL - INDUSTRIAL COMMERCIAL
端子形式 BALL BALL BALL BALL BALL - BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm - 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM
宽度 23 mm 23 mm - 23 mm 23 mm - 23 mm 23 mm
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