电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

89H24NT6AG2ZCHLGI

产品描述FCBGA-484, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小516KB,共35页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览 文档解析

89H24NT6AG2ZCHLGI在线购买

供应商 器件名称 价格 最低购买 库存  
89H24NT6AG2ZCHLGI - - 点击查看 点击购买

89H24NT6AG2ZCHLGI概述

FCBGA-484, Tray

89H24NT6AG2ZCHLGI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明BGA, BGA484,22X22,40
针数484
制造商包装代码HLG484
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionFLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
其他特性ALSO OPERATES AT 100 MHZ
总线兼容性I2C; ISA; VGA
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码S-PBGA-B484
JESD-609代码e1
长度23 mm
湿度敏感等级4
端子数量484
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)250
电源1,3.3 V
认证状态Not Qualified
座面最大高度2.92 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度23 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

文档解析

IDT 89HPES24NT6AG2 是一款高性能 PCI Express Gen2 系统互连开关,提供 24 通道和 6 端口的灵活配置,专为高带宽应用优化。该设备支持 PCI Express Base Specification 2.1,运行速率可达 5.0 GT/s,提供高达 24 GBps 的无阻塞交换容量,确保低延迟数据传输。其直通架构和最大 2KB 负载大小支持,适用于处理多个同时 peer-to-peer 流量流,目标应用包括服务器、存储系统和通信设备。 在功能细节上,设备支持自动链路宽度协商和通道反转,集成 SerDes 可配置每通道的去加重、接收均衡和驱动强度。它还提供单个虚拟通道和八个流量类别,增强流量管理能力。热插拔功能通过外部 I2C I/O 扩展器实现,所有下游端口均支持热插拔操作。此外,时钟系统兼容 100 MHz 和 125 MHz 参考频率,并支持多种时钟模式,包括公共时钟和局部时钟。 应用场景覆盖多主机系统和智能 I/O 架构,其中可靠性特性如端到端 CRC(ECRC)、高级错误报告(AER)和 SECDED ECC 保护,确保数据完整性和系统稳定性。电源管理支持 D0、D3hot 和 D3 状态,结合活动状态电源管理(ASPM),可降低功耗。封装采用 23mm x 23mm 484-ball Flip Chip BGA,便于集成到高密度设计中。

文档预览

下载PDF文档
24-Lane 6-Port PCIe® Gen2
System Interconnect Switch
®
89HPES24NT6AG2
Datasheet
Device Overview
The 89HPES24NT6AG2 is a member of the IDT family of PCI
Express® switching solutions. The PES24NT6AG2 is a 24-lane, 6-port
system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include multi-host or
intelligent I/O based systems where inter-domain communication is
required, such as servers, storage, communications, and embedded
systems.
Features
High Performance Non-Blocking Switch Architecture
24-lane, 6-port PCIe switch with flexible port configuration
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 24 GBps (192 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Port Configurability
Six x4 ports
Automatic per port link width negotiation
(x4
x2
x1)
Crosslink support
Automatic lane reversal
Per lane SerDes configuration
De-emphasis
Receive equalization
Drive strength
Innovative Switch Partitioning Feature
Supports up to 6 fully independent switch partitions
Logically independent switches in the same device
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
Dynamic port reconfiguration — downstream, upstream,
non-transparent bridge
Dynamic migration of ports between partitions
Movable upstream port within and between switch partitions
Non-Transparent Bridging (NTB) Support
Supports up to 6 NT endpoints per switch, each endpoint can
communicate with other switch partitions or external PCIe
domains or CPUs
6 BARs per NT Endpoint
Bar address translation
All BARs support 32/64-bit base and limit address translation
Two BARs (BAR2 and BAR4) support look-up table based
address translation
32 inbound and outbound doorbell registers
4 inbound and outbound message registers
Supports up to 64 masters
Unlimited number of outstanding transactions
Multicast
Compliant with the PCI-SIG multicast
Supports 64 multicast groups
Supports multicast across non-transparent port
Multicast overlay mechanism support
ECRC regeneration support
Integrated Direct Memory Access (DMA) Controllers
Supports up to 2 DMA upstream ports, each with 2 DMA chan-
nels
Supports 32-bit and 64-bit memory-to-memory transfers
Fly-by translation provides reduced latency and increased
performance over buffered approach
Supports arbitrary source and destination address alignment
Supports intra- as well as inter-partition data transfers using
the non-transparent endpoint
Supports DMA transfers to multicast groups
Linked list descriptor-based operation
Flexible addressing modes
Linear addressing
Constant addressing
Quality of Service (QoS)
Port arbitration
Round robin
Request metering
IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible port clocking modes
Common clock
Non-common clock
Local port clock with SSC (spread spectrum setting) and port
reference clock input
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 34
2013 Integrated Device Technology, Inc
December 17, 2013

89H24NT6AG2ZCHLGI相似产品对比

89H24NT6AG2ZCHLGI 89H24NT6AG2ZCHLG8 89H24NT6AG2ZBHL 89H24NT6AG2ZBHLG 89H24NT6AG2ZBHLGI8 89H24NT6AG2ZBHLI 89H24NT6AG2ZCHL 89H24NT6AG2ZCHLG
描述 FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 含铅 不含铅 不含铅 含铅 含铅 不含铅
是否Rohs认证 符合 符合 不符合 符合 符合 不符合 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
针数 484 484 484 484 484 484 484 484
制造商包装代码 HLG484 HLG484 HL484 HLG484 HLG484 HL484 HL484 HLG484
Reach Compliance Code compliant compliant not_compliant compliant compliant not_compliant not_compliant compliant
ECCN代码 EAR99 EAR99 3A001.A.3 EAR99 EAR99 3A001.A.3 3A001.A.3 EAR99
JESD-609代码 e1 e1 e0 e1 e1 e0 e0 e1
湿度敏感等级 4 4 4 4 4 4 4 4
峰值回流温度(摄氏度) 250 250 225 250 250 225 225 250
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
处于峰值回流温度下的最长时间 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
包装说明 BGA, BGA484,22X22,40 - FCBGA-484 BGA, BGA484,22X22,40 , FCBGA-484 23 X 23 MM, 1 MM PITCH, FCBGA-484 23 X 23 MM, 1 MM PITCH, GREEN, FCBGA-484
Samacsys Description FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
其他特性 ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ
总线兼容性 I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA I2C; ISA; VGA
最大时钟频率 125 MHz - 125 MHz 125 MHz - 125 MHz 125 MHz 125 MHz
驱动器接口标准 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 - S-PBGA-B484 S-PBGA-B484 S-PBGA-B484
长度 23 mm - 23 mm 23 mm - 23 mm 23 mm 23 mm
端子数量 484 484 484 484 - 484 484 484
最高工作温度 85 °C 70 °C 70 °C 70 °C - 85 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA - BGA BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 - BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40
封装形状 SQUARE SQUARE SQUARE SQUARE - SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V - 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 2.92 mm - 2.92 mm 2.92 mm - 2.92 mm 2.92 mm 2.92 mm
最大供电电压 1.1 V - 1.1 V 1.1 V - 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V - 0.9 V 0.9 V - 0.9 V 0.9 V 0.9 V
标称供电电压 1 V - 1 V 1 V - 1 V 1 V 1 V
表面贴装 YES YES YES YES - YES YES YES
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL
端子形式 BALL BALL BALL BALL - BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm - 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM
宽度 23 mm - 23 mm 23 mm - 23 mm 23 mm 23 mm
MSP430G2553使用CCS8.0编程注意点总结
本文总结了在利用MSP430G2553做实验时的一些通用错误及注意点,用的软件为CCS8.0,供大家借鉴,具体工程不再给出,若有相似问题或本文有错误,可留言,我尽量回复。文末附有MSP430的用户手册、 ......
fish001 微控制器 MCU
开关电源老烧开关管
pwm芯片是sg6841 开关管换了好几个新的,都烧了,周边电路都测了,没发现问题 ,反正一上电就烧,,搞不懂,尖峰吸收电路的几个电阻,和电容和二极管也查过,没查出问题 ,希望各位大神支支招 ......
yulinqq 模拟与混合信号
华硕p8z77主板+固态硬盘装不了ghost,
华硕p8z77主板+固态硬盘装不了ghost,折腾2天了。自己刻了一个网上下载的iso系统也装不了。但是安装版的是可以的,手上只有32位的安装版系统。现在连系统都不会装了,纠结啊...
elvike 聊聊、笑笑、闹闹
PCB电路设计的14个误区
  现象一:这PCB板子的PCB设计要求不高,就用细一点的线,自动布吧点评:自动布线必然要占用更大的PCB面积,同时产生比手动布线多好多倍的过孔,在批量很大的产品中,PCB厂家降价所考虑的因素 ......
ESD技术咨询 PCB设计
MSP430F5529A支持几个UART口啊??
求大神解答啊,MSP430F5529A支持几个UART口啊??最近要选个单片机做项目,需要至少两个UART串口,不知道这个单片机支持几个啊??...
我看不见 微控制器 MCU
有关基于z stack 的上位机的问题,请大家赐教
需要编写一个基于z stack 的上位机,就是从串口里读取传感器的信息,并显示。最后,往带有电动机的板子上,发送一个启动或者停止信号,启动或者停止电动机。 我的问题是,从串口里 ......
sapphire_lyt 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2765  118  2876  1923  2218  28  22  5  32  47 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved