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89H24NT6AG2ZCHL

产品描述FCBGA-484, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小516KB,共35页
制造商IDT (Integrated Device Technology)
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89H24NT6AG2ZCHL概述

FCBGA-484, Tray

89H24NT6AG2ZCHL规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明23 X 23 MM, 1 MM PITCH, FCBGA-484
针数484
制造商包装代码HL484
Reach Compliance Codenot_compliant
ECCN代码3A001.A.3
其他特性ALSO OPERATES AT 100 MHZ
总线兼容性I2C; ISA; VGA
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码S-PBGA-B484
JESD-609代码e0
长度23 mm
湿度敏感等级4
端子数量484
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,3.3 V
认证状态Not Qualified
座面最大高度2.92 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度23 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

文档解析

89HPES24NT6AG2 的核心创新在于其开关分区功能,允许在单个设备中创建多达 6 个完全独立的逻辑分区,每个分区可独立配置下游端口设备编号。该 PCI Express Gen2 开关具备 24 通道和 6 端口架构,支持 5.0 GT/s 链路速度,适用于需要跨域通信的多处理器系统。非透明桥接(NTB)功能使不同 PCIe 域之间的数据交换成为可能,每个 NT 端点支持 6 个 BAR 地址转换和 32/64 位基础与限制地址映射。 技术特性包括动态重新配置能力,如端口在分区间的迁移和上游端口的动态调整,简化了系统扩展。门铃寄存器和消息寄存器机制实现事件信号和邮箱通信,支持无限数量的未完成事务。多播功能符合 PCI-SIG 标准,提供 64 个多播组,并支持跨非透明端口的多播操作。设备还集成了直接内存访问(DMA)控制器,支持最多 2 个上游端口和 4 个通道,实现高效的内存传输。 目标应用包括高可用性服务器、嵌入式平台和存储解决方案,其中分区和 NTB 功能提升系统隔离性和可靠性。电源供应要求包括 1.0V、2.5V 和 3.3V 电压,热管理通过片上温度传感器实现,可编程阈值提供过热保护。这些特性共同确保设备在严苛环境中稳定运行。

文档预览

下载PDF文档
24-Lane 6-Port PCIe® Gen2
System Interconnect Switch
®
89HPES24NT6AG2
Datasheet
Device Overview
The 89HPES24NT6AG2 is a member of the IDT family of PCI
Express® switching solutions. The PES24NT6AG2 is a 24-lane, 6-port
system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include multi-host or
intelligent I/O based systems where inter-domain communication is
required, such as servers, storage, communications, and embedded
systems.
Features
High Performance Non-Blocking Switch Architecture
24-lane, 6-port PCIe switch with flexible port configuration
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 24 GBps (192 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Port Configurability
Six x4 ports
Automatic per port link width negotiation
(x4
x2
x1)
Crosslink support
Automatic lane reversal
Per lane SerDes configuration
De-emphasis
Receive equalization
Drive strength
Innovative Switch Partitioning Feature
Supports up to 6 fully independent switch partitions
Logically independent switches in the same device
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
Dynamic port reconfiguration — downstream, upstream,
non-transparent bridge
Dynamic migration of ports between partitions
Movable upstream port within and between switch partitions
Non-Transparent Bridging (NTB) Support
Supports up to 6 NT endpoints per switch, each endpoint can
communicate with other switch partitions or external PCIe
domains or CPUs
6 BARs per NT Endpoint
Bar address translation
All BARs support 32/64-bit base and limit address translation
Two BARs (BAR2 and BAR4) support look-up table based
address translation
32 inbound and outbound doorbell registers
4 inbound and outbound message registers
Supports up to 64 masters
Unlimited number of outstanding transactions
Multicast
Compliant with the PCI-SIG multicast
Supports 64 multicast groups
Supports multicast across non-transparent port
Multicast overlay mechanism support
ECRC regeneration support
Integrated Direct Memory Access (DMA) Controllers
Supports up to 2 DMA upstream ports, each with 2 DMA chan-
nels
Supports 32-bit and 64-bit memory-to-memory transfers
Fly-by translation provides reduced latency and increased
performance over buffered approach
Supports arbitrary source and destination address alignment
Supports intra- as well as inter-partition data transfers using
the non-transparent endpoint
Supports DMA transfers to multicast groups
Linked list descriptor-based operation
Flexible addressing modes
Linear addressing
Constant addressing
Quality of Service (QoS)
Port arbitration
Round robin
Request metering
IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible port clocking modes
Common clock
Non-common clock
Local port clock with SSC (spread spectrum setting) and port
reference clock input
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 34
2013 Integrated Device Technology, Inc
December 17, 2013

89H24NT6AG2ZCHL相似产品对比

89H24NT6AG2ZCHL 89H24NT6AG2ZCHLGI 89H24NT6AG2ZCHLG8 89H24NT6AG2ZBHL 89H24NT6AG2ZBHLG 89H24NT6AG2ZBHLGI8 89H24NT6AG2ZBHLI 89H24NT6AG2ZCHLG
描述 FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 含铅 不含铅 不含铅 含铅 不含铅
是否Rohs认证 不符合 符合 符合 不符合 符合 符合 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
针数 484 484 484 484 484 484 484 484
制造商包装代码 HL484 HLG484 HLG484 HL484 HLG484 HLG484 HL484 HLG484
Reach Compliance Code not_compliant compliant compliant not_compliant compliant compliant not_compliant compliant
ECCN代码 3A001.A.3 EAR99 EAR99 3A001.A.3 EAR99 EAR99 3A001.A.3 EAR99
JESD-609代码 e0 e1 e1 e0 e1 e1 e0 e1
湿度敏感等级 4 4 4 4 4 4 4 4
峰值回流温度(摄氏度) 225 250 250 225 250 250 225 250
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子面层 Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
包装说明 23 X 23 MM, 1 MM PITCH, FCBGA-484 BGA, BGA484,22X22,40 - FCBGA-484 BGA, BGA484,22X22,40 , FCBGA-484 23 X 23 MM, 1 MM PITCH, GREEN, FCBGA-484
其他特性 ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ
总线兼容性 I2C; ISA; VGA I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA
最大时钟频率 125 MHz 125 MHz - 125 MHz 125 MHz - 125 MHz 125 MHz
驱动器接口标准 IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 - S-PBGA-B484 S-PBGA-B484
长度 23 mm 23 mm - 23 mm 23 mm - 23 mm 23 mm
端子数量 484 484 484 484 484 - 484 484
最高工作温度 70 °C 85 °C 70 °C 70 °C 70 °C - 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA - BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 - BGA484,22X22,40 BGA484,22X22,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE - SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V - 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 2.92 mm 2.92 mm - 2.92 mm 2.92 mm - 2.92 mm 2.92 mm
最大供电电压 1.1 V 1.1 V - 1.1 V 1.1 V - 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V - 0.9 V 0.9 V - 0.9 V 0.9 V
标称供电电压 1 V 1 V - 1 V 1 V - 1 V 1 V
表面贴装 YES YES YES YES YES - YES YES
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL - INDUSTRIAL COMMERCIAL
端子形式 BALL BALL BALL BALL BALL - BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm - 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM
宽度 23 mm 23 mm - 23 mm 23 mm - 23 mm 23 mm
Samacsys Description - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH

 
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