1 Watt Fully Differential Audio Power Amplifier With Shutdown Select
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 1% |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 1 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.09 mm |
| 最大压摆率 | 8 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.2 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| LM4894MM | LM4894 | LM4894IBP | LM4894ITL | LM4894ITLX | LM4894LD | |
|---|---|---|---|---|---|---|
| 描述 | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | TSSOP, TSSOP10,.19,20 | - | VFBGA, BGA9,3X3,20 | - | VFBGA, BGA9,3X3,20 | HVSON, SOLCC10,.16,20 |
| Reach Compliance Code | _compli | - | not_compliant | - | not_compliant | not_compliant |
| ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
| 标称带宽 | 20 kHz | - | 20 kHz | - | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| 谐波失真 | 1% | - | 1% | - | 1% | 1% |
| JESD-30 代码 | S-PDSO-G10 | - | S-PBGA-B9 | - | S-PBGA-B9 | R-XDSO-N10 |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 |
| 长度 | 3 mm | - | 1.361 mm | - | 1.514 mm | 4 mm |
| 湿度敏感等级 | 1 | - | 1 | - | 1 | 1 |
| 信道数量 | 1 | - | 1 | - | 1 | 1 |
| 功能数量 | 1 | - | 1 | - | 1 | 1 |
| 端子数量 | 10 | - | 9 | - | 9 | 10 |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
| 标称输出功率 | 1 W | - | 1 W | - | 1 W | 1.4 W |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | TSSOP | - | VFBGA | - | VFBGA | HVSON |
| 封装等效代码 | TSSOP10,.19,20 | - | BGA9,3X3,20 | - | BGA9,3X3,20 | SOLCC10,.16,20 |
| 封装形状 | SQUARE | - | SQUARE | - | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | - | 260 | 235 |
| 电源 | 3/5 V | - | 3/5 V | - | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.09 mm | - | 0.85 mm | - | 0.675 mm | 0.8 mm |
| 最大压摆率 | 8 mA | - | 8 mA | - | 8 mA | 8 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.2 V | - | 2.2 V | - | 2.2 V | 2.2 V |
| 表面贴装 | YES | - | YES | - | YES | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | - | BALL | - | BALL | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | - | BOTTOM | - | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 | - | 40 | 30 |
| 宽度 | 3 mm | - | 1.336 mm | - | 1.514 mm | 3 mm |
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