1 Watt Fully Differential Audio Power Amplifier With Shutdown Select
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | VFBGA, BGA9,3X3,20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 1% |
| JESD-30 代码 | S-PBGA-B9 |
| JESD-609代码 | e0 |
| 长度 | 1.361 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 1 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA9,3X3,20 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.85 mm |
| 最大压摆率 | 8 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.2 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 1.336 mm |
| LM4894IBP | LM4894 | LM4894ITL | LM4894ITLX | LM4894LD | LM4894MM | |
|---|---|---|---|---|---|---|
| 描述 | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select | 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | VFBGA, BGA9,3X3,20 | - | - | VFBGA, BGA9,3X3,20 | HVSON, SOLCC10,.16,20 | TSSOP, TSSOP10,.19,20 |
| Reach Compliance Code | not_compliant | - | - | not_compliant | not_compliant | _compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 标称带宽 | 20 kHz | - | - | 20 kHz | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | - | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| 谐波失真 | 1% | - | - | 1% | 1% | 1% |
| JESD-30 代码 | S-PBGA-B9 | - | - | S-PBGA-B9 | R-XDSO-N10 | S-PDSO-G10 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 |
| 长度 | 1.361 mm | - | - | 1.514 mm | 4 mm | 3 mm |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 |
| 信道数量 | 1 | - | - | 1 | 1 | 1 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 9 | - | - | 9 | 10 | 10 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 1 W | - | - | 1 W | 1.4 W | 1 W |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | - | VFBGA | HVSON | TSSOP |
| 封装等效代码 | BGA9,3X3,20 | - | - | BGA9,3X3,20 | SOLCC10,.16,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | - | - | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | - | 260 | 235 | 260 |
| 电源 | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.85 mm | - | - | 0.675 mm | 0.8 mm | 1.09 mm |
| 最大压摆率 | 8 mA | - | - | 8 mA | 8 mA | 8 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.2 V | - | - | 2.2 V | 2.2 V | 2.2 V |
| 表面贴装 | YES | - | - | YES | YES | YES |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | - | - | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | BALL | - | - | BALL | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | - | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | - | 40 | 30 | 40 |
| 宽度 | 1.336 mm | - | - | 1.514 mm | 3 mm | 3 mm |
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